MachineU > China Products > Consumer Electronic > Computer Hardware & Software > Fans & Cooling
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Specifications
Brand Name :
Ziitek
Model Number :
TIF180-12-05US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
24*13*12cm carton
Products name :
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Hardness :
65/20 shore00
Keywords :
Thermal Gap Filler Pad
Color :
Blue
Construction :
Ceramic filled silicone elastomer
Thermal conductive :
1.2W/mK
Density :
2.0g/cm³
Thickness :
2.0mm
Description

Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description
TIF®180-12-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
>Good thermal conductive:1.2W/mK
>Thickness:2.0mmT
>Hardness:20±5 Shore 00
>Colour: blue

>Easy release construction

>Electrically isolating

>High durability

Applications

>Monitoring the Power Box

>AD-DC Power Adapters

>Rainproof LED Power

>notebook

>power supply

>Heat pipe thermal solutions

Typical Properties of TIF®100-12-05US Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.2 W/m-K ASTM D5470
1.2 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm

FAQ

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Product tags

silicone heat sink pad

,

silicon thermal pad

,

silicone cooling pad
Send your message to this supplier
Send Now

Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm

Ask Latest Price
Watch Video
Product Detail
Brand Name :
Ziitek
Model Number :
TIF180-12-05US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm
Notebook Silicone Heat Sink Thermal Gap Filler Pad Thickness 2.0mm

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products CPU Thermal Pad
MachineU China Products Consumer Electronic Computer Hardware & Software Fans & Cooling
Contact Supplier
Submit Requirement