The TIA^®800 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, strong adhesion and electrical insulation. It is suitable for bonding and fixing electronic components to heat sinks or housings, such as LED modules, power devices, communication equipment and other scenarios. The product is solvent-free, pollution-free, easy to construct, and can replace the traditional combination scheme of screw fixation and thermal conductive grease.

Features

> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.