Specifications
Brand Name :
Ziitek
Model Number :
TIE380-45
Certification :
RoHS
Place of Origin :
China
MOQ :
5kg
Payment Terms :
T/T
Delivery Time :
3-8 work days
Packaging Details :
1kg/can
Price :
0.1-100USD/KG
Products name :
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
Feature :
heat cured epoxy adhesive
Usage :
bonding two parts of electronics
Hardness :
92 Shore A
Chemical type :
epoxy
Keywords :
Thermal Epoxy Glue
Thermal conductivity :
4.5W/m-K
Description

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive fillers. It features high thermal conductivity, low shrinkage, high bonding strength, and excellent thermal shock resistance. Ready-to-use,it is suitable for automatic dispensing / screen printing. It is used for structural thermal conductive bonding, fixing,and potting of electronic components and heat sinks, improving heat dissipation efficiency and long-term reliability.

Feature

> High thermal conductivity
> Single-component design, easy and efficient to use
> Strong bonding performance and stable structure
> Low shrinkage rate
> Good thermal shock resistance

Application

> Thermal conductive bonding for power electronic devices
> LED lighting field
> Encapsulation and fixing of precision electronic components
> PCB board heat dissipation treatment
> Thermal conductive bonding of core components of medical devices

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Typical Properties of TIE®380-45
Property Value Test Method
Construction & Composition Epoxy resin -
Appearance (Before Curing) Gray Paste Visual
Appearance (After Curing) Gray Solid Visual
Components Single Component -
Viscosity(cps) 15,000 GB/T 10247
Density(g/cm³) 2 ASTM D2240
Hardness(Shore A) 92 ASTM D2240
Recommended Operating Temperature (°C) -40 ~ 200℃ -
Shear strength (psi) (AI/AI) 25℃ >2900 ASTM D1002
Thermal Conductivity(W/m-K) 4.5 ASTM D5470
Shelf Life (Day) @25℃ 10 (Unopened) -
Shelf Life (Month) @0℃ 6(Unopened) -
Curing Conditions
Curing Temperature 100°C Curing Time 4h Ziitek Test Method
Curing Temperature 125°C Curing Time 4h Ziitek Test Method

Application Guide


Notice:


1.Pleascareulreadthesafetyandhginenformaioneforeuseandstriclfolwteinstructionsontheproductlabeansaftmanual


2.To ensure thatelectronicpackagingcomponentsmaintain stable andexcellent performanceover thelong term,thesurfaceof the components must be thoroughly cleaned before each packaging to remove dust, moisture, salt, grease,and other contaminants. These substances can cause quality issues such as short circuits, poor adhesion, and corrosion.


3. Storage methods and temperature can affect the shelf life.


Safety/Hygiene:


1. Similar to other resin products,this product is irritating to human skin and eyes. In some individuals,skin contact or inhalation of its emitted vapors may cause allergic reactions, primarly characterized by rash and skin itching. In high-temperature work environments,it may also trigger respiratory odor sensitivity.


2. The curing agent is corrosive to skin and eyes. Direct contact can cause burns. In some individuals, skin contact or inhalation of its emitted vapors may cause skin or respiratory allergies,with symptoms including rash, itching,and dificulty breathing. Odor sensitivity of the respiratory system may also occur during handling.


3. Good hygiene and safety practices must be observed when handling this product. Safety goggles and chemical-resistant clothing should be worn during work to avoid direct contact. For detailed information on engineering controls, personal protective equipment (PPE), and first aid measures, please refer to the Product Safety Data Sheet (SDS).


Product Specifications


1 kg/can, 300 ml/tube


If you would like to learn about products in different specifications, please contact our company.
If you want to learn more about thermal conductive materials,please visit our company's website.

Company profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Send your message to this supplier
Send Now

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Ask Latest Price
Brand Name :
Ziitek
Model Number :
TIE380-45
Certification :
RoHS
Place of Origin :
China
MOQ :
5kg
Payment Terms :
T/T
Contact Supplier
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement