TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are mixed in a specific ratio, the adhesive can cure and form into shape either at room temperature or under heating conditions. After curing, it forms a dense elastomer with integrated performance characteristics: good thermal conductivity, electrical insulation, resistance to extreme temperatures, and anti-aging properties. It features low shrinkage rate, can closely adhere to various substrates, and effectively fills the gaps between electronic components. This product delivers comprehensive protection for electronic assemblies, including thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical safeguarding.

• Good thermal conductivity: 1.0W/mK
• Excellent insulation and smooth surface
• Low shrinkage
• Low viscosity, expediting air release
• Excellent resistance to solvents and waterproof
• Longer lifetime
• Excellent thermal shock efficiency and impact resistance

• Between CPU and heat sink
• Between a component and heat sink
• Flat-panel displays
• Power supplies
• High speed mass storage drives
• Telecommunication hardware
• 5G base station & infrastructure
• High-end Chip

1KG A/B for each tank. 5KG A/B each. 10KG A/B each.

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). We have rich experiences in this field which can support you with the latest, most effective and one-step thermal management solutions. We have many advanced production equipment, full test equipment and fully automatic coating production lines which can support the production of high performance thermal silicone pad, thermal graphite sheet/film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

• ISO9001:2015
• ISO14001:2004
• IATF16949:2016
• IECQ QC 080000:2017
• UL