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Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Specifications
Brand Name :
Ziitek
Model Number :
TIF050-11
Certification :
UL
Place of Origin :
China
MOQ :
1000tube
Price :
0.1-100USD/KG
Payment Terms :
T/T
Supply Ability :
10000KG/MONTH
Delivery Time :
3-8 WORK DAYS
Packaging Details :
300cc/tube
Products name :
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Shape :
putty
Application :
Semiconductor Automatic Laboratory Equipment
Color :
Gray
made by :
Ceramic filled silicon material
Keyword :
Thermal gel
Recommended Operating Temp :
-45-200 ℃
Density(g/cc) :
3.20
Description

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocesors, PPGAs, micro

BGA packages, BGA packages, DSP chips, circular silicon chips,LED lighting, and other high-power electronic components.

Feature

>Thermal conductivity: 5.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically

>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF®050-11 Typical Properties
Property Value Test method
Color Gray Visual
Construction & Composition Ceramic filled silicon material -
Flow Rate(g/min) 40 Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc) 3.20g/c ASTM D297
Thermal conductivity 5.0W/mK ASTM D5470
Thermal Impedance @10psi (℃.in²w) 0.077 ASTM D5470
Thermal Impedance @50psi (℃.in²w) 0.068 ASTM D5470
Recommended Operating Temp -45 ~200°C Ziitek Test Method
Dielectric Strength(V/mm) ≥4000 ASTM D149
Bond Line Thickness(mm) 0.20 Ziitek Test Mothod
Flame Rating V-0 UL 94
Shelf Life 12 months -
Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Product tags

thermal conductive silicone pad

,

silicon free thermal gap pad

,

rtv silicone adhesive high temperature
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Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF050-11
Certification :
UL
Place of Origin :
China
MOQ :
1000tube
Price :
0.1-100USD/KG
Contact Supplier
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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