Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules Video from China

Thermal Gap Pad

Sep 11, 2025

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Product Description: China company supplied thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforced construction ...learn more

Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules

Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules

10000/day

negotiation

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Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier

11 Years

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