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Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Specifications
Density（g/cm³） :
3.2
Thermal conductivity& Compostion :
5.0W/m-K
Keywords :
Thermal Conductive Silicone Pad
Brand Name :
ZIITEK
Model Number :
TIF100 5030-05
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-7 work days
Packaging Details :
1000pcs/bag
Construction :
Ceramic filled silicone elastomer
Thickness :
0.010"(0.25mm)~0.200"(5.00mm)
Recommended Operating Temperature (℃) :
-40℃ to 200℃
Payment Terms :
T/T
Products name :
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Hardness :
65/30 Shore 00
Color :
Blue
Application :
GPU Laptop
Description
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
TIF®100 5030-05 Series

TIF®100 5030-05 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Key Features
  • High thermal conductivity
  • Good softness and fillability
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Telecommunication hardware
  • Heat Sinking Housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU
  • Display card
  • Mainboard/mother board
  • Notebook
  • Power supply
Technical Specifications of TIF®100 5030-05 Series
Property Value Test Method
Color Blue Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 30 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 9.0 ASTM D150
Volume Resistivity (Ohm-cm) ＞1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 5.0 ASTM D5470 | ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Meet with customers' requirement - customized

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective, and comprehensive thermal management solutions. Our facilities include advanced production equipment, full test equipment, and fully automatic coating production lines capable of producing high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. All products are compliant with UL94 V-0, SGS, and ROHS standards.

How to Place an Order
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Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad

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Product Detail
Density（g/cm³） :
3.2
Thermal conductivity& Compostion :
5.0W/m-K
Keywords :
Thermal Conductive Silicone Pad
Brand Name :
ZIITEK
Model Number :
TIF100 5030-05
Certification :
UL and RoHs
Contact Supplier
video
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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