Specifications
Brand Name :
Ziitek
Model Number :
TIC800M
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
Negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bay
Payment Terms :
T/T
Name :
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Color :
Silvery white
Thermal Conductivity :
18.9W/mK
Temperature range :
-40℃~250℃
Density :
8.0g/cm³
Keywords :
Phase Changing Materials
Construction & Composition :
Bismuth Alloy
Description

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

TIC®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation problems and improve application reliability. This material has high thermal conductivity,is not easy to evaporate,is safe and non-toxic, and has stable physical and chemical properties. When the temperature is higher than its phase transition temperature, the material will soften and undergo phase transition, which can tightly fill the small irregular contact surfaces on the device surface, forming a low contact thermal resistance thermal interface, thereby achieving excellent heat dissipation effect.

Features

> Excellent thermal conductivity
> Non toxic, environmentally friendly, and safe, meeting RoHS requirements
> Excellent long-term stability
> Thoroughly fill the contact surface to create low thermal resistance
> Not easily volatile

Applications

> Microprocessors
> Chipsets
> Graphic processing chips
> Set Top Box
> LED TV and LED lighting fixtures
Typical Properties of TIC®800M Series
Property Value Test Method
Color Silvery white Visual
Form Flaky solid Visual
Construction & Composition Bismuth Alloy ****
Density (g/cm³) 8.0 ASTM D792
Thermal conductivity(W/mK) 18.9 ISO22007
Specific heat capacity(J/g℃) 0.24 ASTM E1269
Resistivity (Ω-m) <10-4 ASTM D257
Continuous Use Temp(℃) -40 to 250℃ *****
Phase Change Temperature Range(℃) >60 ASTM D3418
Solidification Range(℃) <57 ASTM D3418

Packaing:

TIC®800M can be packaged according to customer requirements.

Usage Instructions:
After using this material, it is recommended to use suitable foam or gaskets to enclose the edges of the phase change metal,
ensuring that the material does not disperse or spread.
For more information about thermal conductive materials, please contact our company.

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Ask Latest Price
Brand Name :
Ziitek
Model Number :
TIC800M
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
Negotiation
Contact Supplier
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Contact Supplier
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