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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
Specifications
Brand Name :
ZIITEK
Model Number :
TIF540BS
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Products name :
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
Continuos Use Temp :
-45℃ to 200℃
Keywords :
Thermal Gap Pad
Density :
3.0g/cc
Hardness :
13/30 Shore 00
Color :
Blue
Thermal conductivity& Compostion :
2.6W/m-K
Thickness :
1.0mmT
Construction :
Ceramic filled silicone elastomer
Application :
CPU/LED/PCB/GPU/SSD
Description

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

TIF®540BS is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.


Features:

> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating

> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating

Applications


> Cooling components to the
> chassis of frame
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light

Typical Properties of TIF®500BS Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.03~0.200 ASTM D374
(0.25~0.75) (0.75~5.0)
Hardness 30 Shore 00

13 Shore 00

 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ＞1.0X1013 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.6 W/m-K ASTM D5470
2.6 W/m-K ISO22007

Product Specifications
Standard Thickness:

0.010 to 0.20 (0.25 to 5.00 mm) with increments of 0.01 (0.25 mm).

Standard Size:

16"X16"(406 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF540BS
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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