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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Specifications
Brand Name :
Ziitek
Model Number :
TIC800G
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5days
Packaging Details :
1000pcs/bay
Product Name :
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Color :
Gray
Keywords :
Phase Changing Materials
Thermal Conductivity :
5.0W/mK
Recommended Use Temp :
-40℃~125℃
Total Thickness :
0.005"/0.127mm
Density :
2.6g/cc
Feature :
Low Thermal Resistant
Description

Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.

Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment


Applications
> Power conversion equipment

> Power supply and vehicle storage battery
> Large communication switch hardware

> LED TV, Lighting
> Laptop computer

Typical Properties of TIC®800G Series
Product Name TIC®805G TIC®806G TIC®808G TIC®810G TIC®812G Test Method
Color Gray Visual
Thickness 0.005" 0.006" 0.008" 0.010" 0.012" ASTM D374
(0.127mm) (0152mm) (0.203mm) (0.254mm) (0.305mm)
Density 2.6g/cc ASTM D792
Recommended Operating Temperature (℃) -40℃～125℃ Ziitek Test Method
Phase Change Softening Temperature(℃) 50℃~60℃ Ziitek Test Method
Thermal Conductivity 5.0 W/mK ASTM D5470
Thermal Impedance(℃-cm²/W) @50 psi 0.014 0.018 0.02 0.024 0.028 ASTM D5470

Standard Thickness:

0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)

For other thickness options, please contact us.


Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.

Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.

Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.

Reinforcement Material: No reinforcement materialrequired.

Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

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Product Detail
Brand Name :
Ziitek
Model Number :
TIC800G
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Contact Supplier
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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