Specifications
Brand Name :
Ziitek
Model Number :
TS-TIR300L
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
0.1-10 USD/PCS
Supply Ability :
100000pcs/day
Delivery Time :
2-3 work days
Packaging Details :
1000pcs/bag
Product name :
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
Thickness :
0.15mm
Density :
1.4 g/cc
Thermal conductivity (Z Axis Direction) :
2.5W/m-K
Hardness :
90 Shore A
Application :
Between Heat Sinks And External casings
Color :
Black
Keywords :
Graphite Composite Thermal Pad
Description

Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.

Feature

> Excellent thermal impedance
> Replaces traditional thermal grease

> High reliability
> Easy to apply to surfaces

Application

> Between transistors and heat sinks

> Between mechanical structures

> Between heat sinks and externalcasings

Typical Properties of TIR®300L series
Product Name TIR®300L Test Method
Colour Black Visual
Reinforcement Carrier Aluminum *****
Thickness range 0.15 mm ASTM D374
Hardness 90 Shore 00 ASTM D2240
Density 1.4g/cc ASTM D792
Volume Resistivity(ohm-cm) 1*102 ASTM D257
Continuous Use Temperature -60℃~ 180℃ Ziitek Test Method
Thermal Conductivity(W/mK) 2.5 ASTM D5470
Thermal impedance(℃-in2/W)@30psi 0.3 ASTM D5470
Thermal impedance(℃-in2/W)@50psi 0.25 ASTM D5470
180° Peel Strength 1.0N/25mm ASTM D3330 (Steel,Immediate)
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Ask Latest Price
Brand Name :
Ziitek
Model Number :
TS-TIR300L
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
0.1-10 USD/PCS
Contact Supplier
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Contact Supplier
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