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Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes
Specifications
Brand Name :
Ziitek
Model Number :
TIE™ 280-25AB
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Delivery Time :
2-3 work day
Packaging Details :
1kg/can
keywords :
Thermal Conductive Glue
Hardness @25℃ :
85 Shore D
Service temperature :
-40℃ to +130℃
Glass transition temperature Tg :
92℃
Elongation :
0.10%
Thermal Conductivity :
2.5 W/m-K
Dielectric Strength :
300 volts / mil
Description

Easy application epoxy potting compound glue electronic epoxy resin adhesive high thermal conductive potting epoxy adhes​

TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

TIE280-25 A&B.pdf

Features

> Good thermal conductive: 2.5W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive


Typical Uncured Material TIE™ 280-25A (Resin)
Color Black
Viscosity@25℃ Brookfield 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-25B (Hardener)
Color Black
Viscosity@25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months n

Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 min
Specific Gravity 2.1g/ccn
Cure Schedule
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

Cured Properties
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion, / ℃ 3.0 X 10-5
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ 0.1

Thermal
Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012

Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

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Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE™ 280-25AB
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Contact Supplier
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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