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Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Specifications
Construction :
Ceramic filled silicone elastomer
Thickness :
Available In Varies Thicknes
Application :
To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Density :
2.25g/cm³
Thermal conductivity :
1.6W/mK
Brand Name :
ZIITEK
Model Number :
TIF100-16-38UF
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Keywords :
Thermal Gap Filler
Hardness :
75 Shore 00
Payment Terms :
T/T
Products name :
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Description

Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance


The TIF®100-16-38UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:


> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

> RoHS compliant
> UL recognized


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules


Typical Properties of TIF®100-16-38UF Series
Property Value Test method
Color Deep red Visual
Construction Ceramic filled silicone elastomer -
Density(g/cm³) 2.25 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness(Shore 00) 75 75 ASTM 2240
Recommend Operating Temperature(℃) -40 to 200℃ -
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1Mhz 5.5 ASTM D150
Volume Resistivity (Ohm-meter) ≥1.0X1012 ASTM D257
Thermal Conductivity (W/m-K) 1.6 ASTM D5470
1.6 ISO22007
Fire rating V-0 UL 94 (E331100)

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.



Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

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Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

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Product Detail
Construction :
Ceramic filled silicone elastomer
Thickness :
Available In Varies Thicknes
Application :
To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Density :
2.25g/cm³
Thermal conductivity :
1.6W/mK
Brand Name :
ZIITEK
Contact Supplier
video
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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