High performance silicone free thermally gap pad Z-paster140-15-02F for no-silicone required case

The Z-paster140-15-02F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

>Silicone-free

>ROSH compliance

>Good thermal conductive:1.5 W/mK

>Soft and Compressible for low stress applications

>Available in varies thickness

Application

>Cooling components to the chassis of frame

>Car Battery & Power Supply

>Charging Pile

>Silicone-sensitive applications

>Graphics Card Thermal Module

>Set Top Box

> Medical devices

>LED Lighting

>SFP optical module

>Miniature heat tube radiator

Standard size

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.