Thermal Gap Filler Pads Low Volatility Silicone Material for Enhanced Thermal Conductivity in Electronic Components and Optical Devices

Products description

The TIF^®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fil the micro gaps between the heating interface and the heat dissipation structure,significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.

Features

>Ultra low volatility of siloxane
>Good thermal conductivity
>Excellent weather resistance and aging resistance
>Highly compressible, easy to install and operate
>Good insulation performance

Applications

>Embedded Motherboard
>Industrial visual inspection equipment
>Graphics card cooling module
>Charging pile power module
>Central control screen

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)

The TIF^® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Independent R&D team

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FAQ

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.