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Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Specifications
Product Name :
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Color :
Gray
Thermal Conductivity :
9.6W/mK
Packaging Details :
1000pcs/bay
Application :
Server CPU &Chip Sets
Brand Name :
Ziitek
Certification :
RoHs
Model Number :
TIC808T
Supply Ability :
100000pcs/day
Price :
negotiation
Payment Terms :
T/T
Phase Change Softening Temperature(℃） :
50℃~60℃
Delivery Time :
7-15days
Recommend Operating Temperature :
-40℃～125℃
Place of Origin :
China
Density :
2.8g/cm³
Keywords :
Phase Changing Materials
MOQ :
1000PCS
Description

Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets


The TIC®800T Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50℃, the material can soften and infiltrate the interface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the eficiency of the heat dissipation system.


Features


> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance


Applications


> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation


Typical Properties of TIC®800T Series
Product Name TIC®808T TIC®810T Testing standards
Color Gray Visual

Thickness(inch/mm)

 0.008" 0.010" ASTM D374
(0.20mm) (0.25mm)
Density(g/cm³) 2.8 ASTM D792
Recommended Operating
Temperature (℃)		 -40～125 -
Phase Change Softening Temperature(℃) 50~60 -
Thermal conductivity 9.6 W/mK ASTM D5470

Thermal lmpedance

(℃-in²/W)@10 psi

 0.018 0.019 ASTM D5470

Thermal lmpedance

(℃-in²/W)@50 psi

 0.013 0.014 ASTM D5470


Product Specifications
Standard Thickness:0.008" (0.20 mm), 0.010" (0.25 mm)
Standard Size: 10" x 16" (254 mm x 406 mm)


TIC®series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.

Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

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Product Detail
Product Name :
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Color :
Gray
Thermal Conductivity :
9.6W/mK
Packaging Details :
1000pcs/bay
Application :
Server CPU &Chip Sets
Brand Name :
Ziitek
Contact Supplier
video
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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