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1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
Specifications
Brand Name :
ZIITEK
Model Number :
TIF170-30-06UF
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
keyword :
Thermal Gap Pad
Thickness :
1.75mmT
Fire rating :
94 V0
name :
1.75mmT Heat Snk Pad Easy Release Construction for Display Card
Feature :
Easy release construction
Continuos Use Temp :
-40 to 160℃
Description

1.75mmT Heat Snk Pad Easy Release Construction for Display Card

The TIF170-30-06UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-30-06UF-Series-Datasheet-.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 1.75mmT

>hardness:75±5 shore 00

>Colour: White

>Good thermal conductive
Moldability for complex parts
Soft and compressible for low stress applications

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

Typical Properties of TIF170-30-06UF Series
Color
White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity
3.0 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.75mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.32%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

5.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
2.3X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

FAQ:

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Product tags

thermal gap filler pad

,

thermal gap pad

,

flexitank heating pad
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1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF170-30-06UF
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction
1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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