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5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules
5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules
5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules
5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules
Specifications
Brand Name :
ZIITEK
Model Number :
TIF160N-50-10F thermal pad
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
keyword :
Thermal Gap Pad
Continuos Use Temp :
-40 to 160℃
hardness :
55±5 shore 00
name :
5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules
part number :
TIF160N-50-10F
Certifications: :
IECQ QC 080000
Description

5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules

The TIF160N-50-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100N-40-10F-Specification-sheet.pdf

Features

> Good thermal conductive: 5.0 W/mK

>Thickness: 1.5mmT

>hardness:55±5 shore 00

>Colour: Gray

>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications

Applications

>mainboard/mother boar

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF160N-50-10F Series
Color
 Gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.1 g/cm3

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
5.0W/mk
ISO22007-2.2
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.7 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

5.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Product tags

laptop heatsink pad

,

usb laptop cooling pads

,

heatsink cooling thermal conductive silicone pad
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5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF160N-50-10F thermal pad
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules
5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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