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Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-07S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-7work days
Packaging Details :
1000pcs/bag
Color :
Green
Application :
Home Appliance Industry
Thermal conductivity& Compostion :
1.5 W/m-K
Hardness(Shore 00) :
65/45
Recommended Operating Temperature :
-40 to 200℃
Keywords :
Thermal Gap Filler
Payment Terms :
T/T
Products name :
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Density :
2.2 g/cm³
Construction :
Ceramic filled silicone elastomer
Description
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
TIF®100-07S is a silicone-based, thermally conductive gap pad featuring an unreinforced construction for enhanced compliancy. This product offers low hardness, excellent conformability, and electrical isolation. The low modulus characteristic ensures optimal thermal performance with easy handling.
Key Features
  • Good thermal conductivity: 1.5 W/mK
  • Naturally tacky - no additional adhesive coating required
  • Soft and compressible for low stress applications
  • Available in various thicknesses
  • Moldable for complex parts
  • RoHS compliant
  • Easy release construction
Applications
  • Cooling components to chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Typical Properties
Property Value Test Method
Color Green Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 2.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Our Services

Online Service: 12 hours, inquiry reply within fastest time

Working Time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Well-trained & experienced staff available to answer all inquiries in English

Standard Export Carton or marked with customer's information or customized packaging

Free samples available

After-service: Even with strict inspection, if parts don't work properly, provide proof and we'll help resolve the issue with satisfactory solutions.

Frequently Asked Questions
How do I place an order?
1. Click the "Send messages" button to continue with the process.
2. Fill out the message form with subject line and message including any questions and purchase requests.
3. Click the "Send" button to complete the process.
4. We will reply as soon as possible via Email or online.
How to find the right thermal conductivity for my applications?
It depends on the watts of power source and heat dissipation ability. Please provide detailed applications and power specifications, and we can recommend the most suitable thermal conductive materials.
Do you accept custom orders?
Yes, we welcome custom orders. Our custom elements include dimension, shape, color, and coating options (single or double-sided adhesive, fiberglass coating). Please provide a drawing or detailed custom order information.
Product tags

heatsink thermal pads

,

thermal gap filler pad

,

heatsink cooling thermal conductive silicone pad
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Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-07S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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