MachineU > China Products > Chemicals > Adhesives & Sealants
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Specifications
Packing :
1kg/can
Payment Terms :
T/T
Keywords :
Thermally Conductive Potting Compound
Hardness(Shore 00) :
65
Thermal Conductivity :
1.0 W/m-K
Density(g/cm³） :
1.73
Price :
Negotiation
Name :
Two Component Silicone Thermally Conductive Potting Compound For Gluing Metal And PCB
Brand Name :
Ziitek
Model Number :
TIS680-10AB
Certification :
RoHs
Place of Origin :
China
MOQ :
1KG/PC
Supply Ability :
100KG
Delivery Time :
3-7 work day
Packaging Details :
1kg/can
Components :
Two Component
Continuous Use Temp :
-45 to 200℃
Description
Two Component Silicone Thermally Conductive Potting Compound For Gluing Metal And PCB
TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are mixed in a specific ratio, the adhesive can cure and form into shape either at room temperature or under heating conditions. After curing, it forms a dense elastomer with integrated performance characteristics: good thermal conductivity, electrical insulation, resistance to extreme temperatures, and anti-aging properties. It features low shrinkage rate, can closely adhere to various substrates, and effectively fills the gaps between electronic components. This product delivers comprehensive protection for electronic assemblies, including thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical safeguarding.
Key Features
  • Good thermal conductivity
  • Good electrical insulation performance
  • Controllable curing performance
  • Flexibly adjustable mechanical properties
  • Low viscosity facilitating gas release
  • Excellent solvent and water resistance
  • Excellent process compatibility
  • Excellent resistance to extreme temperatures
Applications
  • New energy vehicle electronics
  • Industrial electronics and power equipment
  • Consumer electronics
  • Medical electronics
  • Aerospace electronic components
  • Rail transit electronic equipment
  • Marine detection equipment
Typical Properties of TIS ®680-10AB Series
Uncured Material Properties
Construction Ceremic-filled silicone -
Color/Part A White Visual
Color/Part B Black Visual
Part A Viscosity (mPa.s) 3500 GB/T 10247
Part B Viscosity (mPa.s) 3500 GB/T 10247
Mix Ratio 1:1 -
Shelf life (months) 6 (Unopened) -
Cure Schedule
Pot Life @25℃ 30 mins Ziitek Test Method
Cure @25℃ 3 hours Ziitek Test Method
Cure @70℃ 20 mins Ziitek Test Method
Cure Material Properties
Color Gray White Visual
Hardness (Shore 00) 65 ASTM D2240
Density (g/cm³) 1.73 ASTM D792
Recommended Operating temperature (℃) -45 ~200 -
Flame Rating V-0 UL 94
Thermal Conductivity (W/mK) 1.0 ASTM D5470
Breakdown Voltage (V/mm) ≥7000 ASTM D149
Dielectric Constant @1MHz 4.2 ASTM D150
Volume Resistivity (Ohm*cm) ＞1.0x10¹² ASTM D257
Instructions For Use
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Product Packaging
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). We have rich experiences in this field which can support you with the latest, most effective and one-step thermal management solutions. We have many advanced production equipment, full test equipment and fully automatic coating production lines which can support the production of high performance thermal silicone pad, thermal graphite sheet/film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Why Choose Us?
  • Our value message is "Do it right the First time, total quality control"
  • Our core competencies is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement Business Secrect Contract
  • Free sample offer
  • Quality assurance contract
Product tags

thermally conductive silicone adhesive

,

high thermal conductivity adhesive

,

high temperature bonding adhesive
Send your message to this supplier
Send Now

Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB

Ask Latest Price
Product Detail
Packing :
1kg/can
Payment Terms :
T/T
Keywords :
Thermally Conductive Potting Compound
Hardness(Shore 00) :
65
Thermal Conductivity :
1.0 W/m-K
Density(g/cm³） :
1.73
Contact Supplier
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB
Two Component Silicone Thermally Conductive Potting Compound with 1.0 W/m-K for Gluing Metal And PCB

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Thermal Conductive Adhesive
MachineU China Products Chemicals Adhesives & Sealants
Contact Supplier
Submit Requirement