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Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Specifications
Density :
2.3 g/cm³
Application :
For Thermal Management In Electronics
Color :
Yellow
Keywords :
Thermal Gap Filler
Flame Rating :
UL94 V-0
Brand Name :
ZIITEK
Model Number :
TIF150-19S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-7work days
Packaging Details :
1000pcs/bag
Breakdown Voltage(V/mm) :
≥5500
Thermal conductivity :
1.5W/mK
Hardness :
65/45 Shore 00
Products name :
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Payment Terms :
T/T
Sample :
free
Description
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd., established in 2006, is a high-tech enterprise specializing in the research, development, production, and sales of thermal interface materials. Our product range includes heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad, heat-conducting grease, heat-conducting plastic, silicone rubber, and silicone rubber foam.

We adhere to the business philosophy of "survival by quality, development by quality," and continue to provide efficient, high-quality service with a spirit of rigor, pragmatism, and innovation.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Product Description

The TIF®150-19S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and ease of use, effectively transferring heat and providing basic physical protection for electronic components.

Features
  • Good thermal conductivity
  • Good softness and fillability
  • Self-adhesive without additional surface adhesives
  • Good insulation performance
  • RoHS compliant
  • UL recognized
Applications
  • Cooling components to the chassis or frame
  • High-speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU
  • Display card
  • Mainboard/motherboard
Typical Properties of TIF®100-19S Series
Property Value Test Method
Color Yellow Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00)		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Why Choose Us?
Our value message: "Do it right the First time, total quality control"
Core competencies in thermal conductive interface materials
Competitive advantage products
Confidentiality agreement and business secret contract
Free sample offer
Quality assurance contract
Ziitek Culture

Quality: Do it right the first time, total quality control

Effectiveness: Work precisely and thoroughly for effectiveness

Service: Quick response, on-time delivery, and excellent service

Team Work: Complete teamwork across sales, marketing, engineering, R&D, manufacturing, and logistics teams to provide satisfying service for customers

Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Product tags

thermal gap filler pad

,

silicon free thermal gap pad

,

thermal conductive silicone pad
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Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics

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Product Detail
Density :
2.3 g/cm³
Application :
For Thermal Management In Electronics
Color :
Yellow
Keywords :
Thermal Gap Filler
Flame Rating :
UL94 V-0
Brand Name :
ZIITEK
Contact Supplier
video
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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