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Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-30-02US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Products name :
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Thickness :
Available In Varies Thicknes
Thermal conductivity :
3.0W/m-K
Hardness :
65/20 Shore 00
Density :
3.0 g/cm³
Application :
Telecommunication Hardware
Keywords :
Thermal Gap Fillers
Color :
Gray white
Description

Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity

The TIF®100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive:3.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF®100-30-02US Series
Property Value Test method
Color Gray white Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Company profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Product tags

guowang composite insulators

,

mica sheet thermal conductivity

,

high thermal conductivity plastic
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Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-30-02US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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