PI Heating Film
Description
This flame-retardant PI epoxy heat press adhesive film is a high-performance bonding material with excellent adhesion, high-temperature resistance, and chemical resistance, ideal for automotive and flexible circuit applications.
Applications
- Heater circuit stone engraving
- Flexible printed circuit (FPC) manufacturing
- New energy power battery temperature control collection lines
- Bonding and lamination of hot-pressed copper
- Bonding and lamination of stainless steel materials
- Automotive electronic component assembly
Physical Parameters
| Item |
Specification |
| Base Material |
PI (Polyimide) film |
| Thickness |
0.025T – 0.125T (standard: 0.05T, 0.08T) |
| Release Liner |
PET release film |
| Roll Width |
500 mm, 980 mm |
| Adhesive |
Flame-retardant epoxy heat press adhesive |
| Color |
Black, tea color |
FAQ
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Q: What materials can this adhesive film bond to?
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A: It is primarily used for bonding hot-pressed copper and stainless steel.
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Q: What industries is this product suitable for?
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A: It is ideal for the new energy automotive industry, especially for battery and FPC applications.
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Q: What are the key advantages of this adhesive?
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A: It offers excellent bonding strength, high-temperature resistance, anti-cracking properties, and chemical resistance.
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Q: Can it withstand harsh chemical environments?
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A: Yes, it shows no reaction after 25 hours of immersion in acids (HCl 0.1N, H₂SO₄ 95%) and bases (NaOH 10%).
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Q: What colors are available for this product?
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A: It is available in black and tea color.
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Q: What is the processing capability after hot pressing?
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A: After hot pressing, it can undergo various sheet metal processes.