Specifications
MOQ :
100
Model NO. :
HC-FPC-002
Combination Mode :
Adhesive Flexible Plate
Conductive Adhesive :
Conductive Silver Paste
Flame Retardant :
HB
Processing Technology :
Electrolytic Foil
Base Material :
Aluminum
Insulation Materials :
Organic Resin
Average Thickness :
1.1-0. Am
Copper Foil Type :
Electrolytic and Rolled
Copper Foil Thickness :
1oz, 1/2oz, 1/3oz
Substrate Film Thickness :
1mil, 1/2mil
Cover Film Thickness :
1mil, 1/2mil
Stiffener Thickness :
3mil to 9mil
Production Capacity :
100,000PCS/Month
HS Code :
8536500000
Description
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.
Key Features and Benefits
  • Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
  • Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
  • Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
  • Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
  • Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
  • Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
  • Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties
Material Composition
Copper Foil Substrate:
  • Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
  • Substrate Film: Common thickness of 1mil and 1/2mil
  • Adhesive: Thickness customized to customer requirements
Cover Film Protection:
  • Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
  • Adhesive: Thickness customized to customer requirements
  • Prevents adhesive buildup and foreign matter before pressing
Stiffener (PI Stiffener Film):
  • Reinforces mechanical strength for surface mounting
  • Common thickness: 3mil to 9mil
  • Adhesive: Thickness customized to customer requirements
EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.
Competitive Advantages
  • Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
  • Compact Size: Small volume PCB effectively reduces product dimensions
  • Lightweight: Significantly lighter than traditional rigid PCBs
  • Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
  • Quick Delivery
  • Premium Services
  • OEM/ODM Customization Available
Application Images
Double-Sided Flexible Printing Membrane Printed FPC Circuit Double-Sided Flexible Printing Membrane Printed FPC Circuit Double-Sided Flexible Printing Membrane Printed FPC Circuit Double-Sided Flexible Printing Membrane Printed FPC Circuit Double-Sided Flexible Printing Membrane Printed FPC Circuit
Send your message to this supplier
Send Now

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Ask Latest Price
MOQ :
100
Model NO. :
HC-FPC-002
Combination Mode :
Adhesive Flexible Plate
Conductive Adhesive :
Conductive Silver Paste
Flame Retardant :
HB
Processing Technology :
Electrolytic Foil
Contact Supplier
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-Sided Flexible Printing Membrane Printed FPC Circuit

TKM MEMBRANE TECHNOLOGY LTD.

Verified Supplier
13 Years
guangdong, dongguan
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
5 Million-6 Million
Employee Number :
120~200
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement