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Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Specifications
Place of Origin :
dongguang china
Brand Name :
SMTfly
Certification :
CE ISO9001
Model Number :
SMTflyACF1
MOQ :
1 reel
Price :
USD380
Packaging Details :
each set be packed in plywood case
Delivery Time :
1-3 days after payment confirm
Payment Terms :
TT in advance
Supply Ability :
300 set/month
Description

Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD

Application
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in COF and COB areas.

Examples of ACF applications.

- TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding (IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding (IC-FPC)
- Plasma Display (FPC-PDP)
- Flip Chip Package

Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

Our special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

ACF Bonding Instruction
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Product tags

2.25 thermal register tape

,

heatsink thermal tape

,

high temperature adhesive tapes
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Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD

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Product Detail
Place of Origin :
dongguang china
Brand Name :
SMTfly
Certification :
CE ISO9001
Model Number :
SMTflyACF1
MOQ :
1 reel
Price :
USD380
Contact Supplier
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD
Temperature Resist Acf Tapes For Pulse Heat Bonding Machine LCD

Shenzhen SMTfly Electronic Equipment Manufactory Ltd

Active Member
10 Years
chongqing, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter
Main Products :
PCB Separator For Motorized, PCB Depanelizer For Pneumatic, PCB Depaneling For Manual
Total Annual :
40% - 50%
Employee Number :
100~500
Certification Level :
Active Member
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