. Description :
| Layer: | 1 layer-30 layers |
| Board thickness: | 0.2mm-6.0mm |
| Copper thickness: | 0.5oz-6.0 oz |
| Max board size : | 600 x 1200mm |
| Min. hole diameter: | 0.1mm |
| Min. line width: | 0.075mm |
| file format: | pcb,doc,ddb etc |
| MOQ: | 1 piece |
| Base material: | FR-4,TG, CEM-1, CEM-3, Aluminium,94V0, 94HB |
| Solder mask & Silkscreen: | green, red, blue, yellow, black, white etc |
| Surface finish: | ENIG, ImAg, ImSn, OSP, HASL, lead free,immersion gold,Gold-plate etc |
. Pictures :



