Specifications
Brand Name :
Hanast
Model Number :
HN-8808AB
Certification :
MSDS
Place of Origin :
CHINA
MOQ :
1KG
Price :
5.7
Payment Terms :
T/T
Supply Ability :
20000000KG
Delivery Time :
3-7 work days
Packaging Details :
Bucket package
Product name :
Silicone potting glue
Color :
Black/White/Transparent color, can customized
Application :
PCB/Battery/LED
Package :
5kgs/25kgs/200kgs/bag
Material :
Silicone&Agent
Keywords :
Waterproof Sealant
Viscosity :
Excellent Viscosity
Certificate :
MSDS RoHS UL
Feature :
Low and high Temperature Resistance
Thermal conductivity :
Customize
Description

HN-8808 two-component room temperature curing potting silicone

Product Specification

№. Items Technique Request
1 Exterior Transparent / White / Grey Liquid
2 Viscosity mPa.S (before curing) A: 2000, B: 50
3 Specific gravity (23℃) 0.98
4 In commission time (h, 25℃) 1–2h
5 Entirely sulfuration time (min, 25℃) 8–12h
6 Hardness (JIS A) 25A
7 Volume resistivity (Ω·cm) ≥1×10¹⁴
8 Strength of breakdown voltage (kV/mm) 18–25
9 Dielectric constant (1MHz) 2.5–3.0
10 Dielectric loss (1MHz) ≤4×10⁻³
11 Thermal conductivity (W/m·K) 0.1–0.20

Product Details

HN-8808 is a two-component room-temperature curing silicone specifically designed for the electronics industry. It offers excellent electrical properties and temperature resistance, making it ideal for PCB potting, sensor sealing, and LED encapsulation.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Key Advantages

High Insulation: Volume resistivity ≥1×10¹⁴ Ω·cm, breakdown voltage strength 18-25 kV/mm.

High-Temperature Resistance: Operating temperature range from -57°C to 250°C, suitable for high-temperature environments.

Fast Curing: Fully cures in 8-12 hours at room temperature, improving production efficiency.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Technical Parameters

Viscosity (Part A: 2000 mPa.S, Part B: 50 mPa.S)

Hardness (JIS A): 25A

Dielectric Constant (1MHz): 2.5-3.0

Thermal Conductivity: 0.1-0.20 W/m·K

Applications

PCB Potting: Protects circuit boards from moisture and vibration.

Sensor Sealing: Enhances durability and reliability of sensors.

LED Encapsulation: Provides excellent heat dissipation and insulation

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

   

Packing specifications
Component A: 10KG/20KG plastic barrel

Component B: 1KG plastic barrel

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Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

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Brand Name :
Hanast
Model Number :
HN-8808AB
Certification :
MSDS
Place of Origin :
CHINA
MOQ :
1KG
Price :
5.7
Contact Supplier
video
Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM
Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM
Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM
Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Shenzhen Haneste New Material co.,LTD

Verified Supplier
1 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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