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Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Specifications
Viscosity A :
2200-2600 mPa.s @ 25C
Certification :
RoHS
Supply Ability :
50 Tons per Month
Viscosity B :
20-30 mPa.s @ 25C
Dielectric Strength :
>= 14 kV/mm
Packaging Details :
22kg/set (A 20kg + B 2kg) or 11kg/set (A 10kg + B 1kg)
MOQ :
1kg
Delivery Time :
7-15 days after confirmation
Mix Ratio :
10:1 by weight
Place of Origin :
Shenzhen, Guangdong, China
Density A :
0.94 +/- 0.02 g/cm3
Dielectric Constant :
<= 3.0
Brand Name :
Hanast
Model Number :
HN-8808AB
Payment Terms :
T/T,L/C,Western Union
Description

Hanast HN-8808A/B Crystal-Clear RTV-2 Electronic Potting Compound

Hanast HN-8808A/B is a two-component transparent condensation-cure RTV-2 silicone potting compound formulated for electronic assemblies where post-potting visual inspection is essential. Mixed at a 10:1 ratio by weight, it cures at room temperature into a water-clear elastomer that allows technicians to inspect solder joints, component leads and LED emitters without removing the encapsulant — a significant advantage over opaque or grey-compound alternatives.

Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation

Why HN-8808A/B Beats Opaque Compounds

Selling Point Competitor Gap Hanast Advantage
Crystal-Cure Transparency Most RTV-2 compounds cure to white/grey/opaque finish, hiding defects Water-clear cured elastomer enables 100% visual QA without destructive teardown — reduces warranty cost and rework labor by up to 40%
Low Dielectric Constant ≤3.0 Typical RTV-2 values range 3.5–4.5, degrading high-frequency signals Dielectric constant ≤3.0 preserves RF signal integrity and minimizes signal delay in high-speed digital circuits, making HN-8808A/B suitable for 5G modules and Wi-Fi routers
Substrate-Density 0.94 g/cm³ Dense fillers (>1.5 g/cm³) sink in deep cavities, causing uneven protection Low density formula remains suspended in tall cavities, ensuring uniform depth protection for tall capacitors and connectors without segregation during cure

Complete Technical Data Sheet (HN-8808A/B)

Property Test Method Unit Value
Mix Ratio (A:B) By weight — 10:1
Viscosity Component A (25°C) GB/T 2794-1995 mPa·s 2200–2600
Viscosity Component B (25°C) GB/T 2794-1995 mPa·s 20–30
Mixed Viscosity (25°C) GB/T 2794-1995 mPa·s 2200–2600
Density (Component A, 25°C) GB/T 2794-1995 g/cm³ 0.94 ± 0.02
Full Cure Time (25°C) Measured h 8–24
Cured Appearance Visual — Transparent (water-clear)
Dielectric Strength Standard kV/mm ≥14
Dielectric Constant Standard — ≤3.0
Elongation at Break Standard % ≤100
Operating Temperature Range Measured °C -50 to 200
Shrinkage Measured — Small chemical shrinkage; no exotherm
Compliance Standard — RoHS compliant

B2B Application Scenarios (Expanded Coverage)

  • LED Driver Power Supplies — Clear encapsulation enabling post-installation LED brightness verification and thermal hotspot identification
  • 5G / Wi-Fi Router Modules — Low dielectric constant (≤3.0) preserves RF signal fidelity for antennas and baseband processors
  • High-Speed Digital Circuit Boards — Minimal signal delay due to ultra-low dielectric constant; ideal for DDR memory interfaces and USB 3.0+ traces
  • Aluminum-Substrate LED Modules — Primer-free adhesion to extruded aluminum heat-sink fins eliminates secondary bonding steps
  • Automotive Sensor Harnesses — Waterproof sealant protecting oxygen sensors, ABS modules and camshaft position sensors
  • Medical Device Electronics — Non-corrosive, biocompatible-compatible sealing for diagnostic equipment internal assemblies
  • Packaging Metering Systems — Moisture-proof encapsulation for precision flow-control boards exposed to humidity
  • Photovoltaic Inverters — UV-stable, anti-yellowing outdoor protection for junction-box control boards
  • Telecom Base-Station Equipment — Wide-temp (-50~200°C) reliability for remote outdoor cabinet installations
  • Consumer Smart Home Devices — Transparent aesthetic finishing allowing visible PCB layout in luxury smart switches and displays
  • Industrial Control Panels — Vibration-resistant elastomer cushioning for relay and PLC module protection
  • Aviation Instrument Panels — Stable long-term performance under extreme thermal cycling without yellowing or cracking

Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation

HN-8808A/B vs Standard Grey Potting Compound

Feature HN-8808A/B (Transparent) Standard Grey Compound
Cured Color Crystal Clear ✓ Opaque Grey
Visual Inspection Yes — see through encapsulant No — must remove to inspect
Dielectric Constant ≤3.0 (low) 3.5–4.5 (higher)
Signal Impact Negligible RF attenuation Potential signal degradation
Chemical Shrinkage Minimal Moderate
Exotherm During Cure None Moderate

Mixing & Application Instructions

  1. Pre-mix: Stir Component A thoroughly before use (fillers may settle); shake Component B well.
  2. Weigh: Measure A:B at 10:1 ratio by weight using precision scale.
  3. Mix: Blend in one direction until uniform color; scrape walls and bottom. Do not prepare large batches by hand — cure accelerates in warm conditions.
  4. Degas: Vacuum degas to remove entrapped air. Do NOT completely seal device until mass fully released (3 days summer / 7 days winter).
  5. Pour: Dispense degassed compound into clean, dry device within working time.
  6. Cure: Room temperature 8–24 h for full cure. After initial set, gentle heating (≤60°C) may accelerate but ONLY after initial cure.

About This Supplier

Shenzhen Hanast New Materials Co., Ltd. is a professional manufacturer of liquid silicone rubber specialising in addition-cure (platinum) and condensation-cure silicone for mould making. Our HN-E6XX platinum series covers 0–60 Shore A and is certified to FDA, MSDS, RoHS and REACH, serving customers in jewellery, arts & crafts, construction, food-contact and precision casting industries worldwide.
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation

Frequently Asked Questions

Q1: Can I visually inspect potted components through the cured material?
A1: Yes. HN-8808A/B cures to a water-clear, glass-like elastomer that allows 100% visual inspection of solder joints, LEDs and trace routing without removal.
Q2: Why is a low dielectric constant important for RF applications?
A2: Dielectric constant directly affects signal propagation speed and capacitance. At ≤3.0, HN-8808A/B introduces minimal signal delay and attenuation, preserving bandwidth integrity in 5G/Wi-Fi modules and high-speed digital circuits.
Q3: Do I need a primer to bond this compound to aluminum heatsinks?
A3: No. HN-8808A/B provides excellent adhesion to aluminum substrates without requiring a primer or surface treatment, reducing process complexity and material cost.
Q4: Is it safe to apply gentle heat immediately after mixing?
A4: No. Due to the condensation cure mechanism, small volatile molecules are released during reaction. Heating above 60°C before initial cure can trap gases and create voids. Wait for initial set (~2 h), then gentle post-cure heat is safe.
Q5: What packaging formats are available for production-scale orders?
A5: Standard kits: 22 kg/set (A 20 kg + B 2 kg iron/plastic drum) or 11 kg/set (A 10 kg + B 1 kg). Custom packaging such as 5 kg or 50 kg drums available for OEM/ODM projects.
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Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation

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Product Detail
Viscosity A :
2200-2600 mPa.s @ 25C
Certification :
RoHS
Supply Ability :
50 Tons per Month
Viscosity B :
20-30 mPa.s @ 25C
Dielectric Strength :
>= 14 kV/mm
Packaging Details :
22kg/set (A 20kg + B 2kg) or 11kg/set (A 10kg + B 1kg)
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Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation
Clear Condensation Cure RTV-2 Silicone Potting Compound for Visual Inspection Electronic Encapsulation

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Main Products :
Silicone Potting Compound, Epoxy Potting Compound, Platinum Cure Silicone Rubber
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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