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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
Specifications
Brand Name :
Hanast
Model Number :
HN-8810
Certification :
ROHS
Place of Origin :
Guangdong, China
MOQ :
1KG
Price :
Negotiable
Payment Terms :
T/T、paypal
Supply Ability :
100ton/month
Delivery Time :
5-7days
Packaging Details :
50KG/set, 25KG/bar
Name :
silicone potting compound for electronics
Mix ratio :
1:1
Color :
Grey,white,black
Features :
1.0 thermal conductivity
MOQ :
1-2KG
wide temperature range :
-50°C to 250°C
Hardness :
50±5 SHORE A
Application :
New Energy Vehicle Power Batteries and Thermal Management Systems
Shelf time :
6months
Cusomization :
Support
Description

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

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Product Detail
Brand Name :
Hanast
Model Number :
HN-8810
Certification :
ROHS
Place of Origin :
Guangdong, China
MOQ :
1KG
Price :
Negotiable
Contact Supplier
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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer, Agent, Trading Company
Main Products :
Silicone Potting Compound, Epoxy Potting Compound, Platinum Cure Silicone Rubber
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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