Specifications
Mixing Ratio :
1:1 (A:B)
Color :
Gray/White
Temperature Range :
-40°C to +150°C
Viscosity :
2000-3000 mPa.s
Place of Origin :
Guangdong, China
Delivery Time :
3-5 working days for stock, 10-15 days for production
Hardness :
45-50 Shore A
Thermal Conductivity :
1.0 W/m·K
Volume Resistivity :
≥5.0×10^14 Ω·cm
Supply Ability :
50000 Kg per Month
Flame Retardancy :
UL 94 V-0
Brand Name :
HANAST
Packaging Details :
50Kg/set (A 25Kg + B 25Kg), export-grade steel drum or plastic pail
Type :
Two-Component Addition Cure Silicone
Curing Type :
Room Temperature or Heat Accelerated
Model Number :
HN-8810A/B
MOQ :
1 Kg
Payment Terms :
T/T,L/C,PayPal,WU
Certification :
RoHS, REACH, UL 94 V-0
Description

1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for Electronic Component Encapsulation

The HN-8810A/B 1.0 W/mK Thermal Conductivity Silicone Potting Compound is a two-component addition-cure silicone system engineered for PCB power modules, LED drivers, and electronic component encapsulation. With UL 94 V-0 flame retardancy certification and 1.0 W/m·K thermal conductivity, this compound provides balanced heat dissipation, superior electrical insulation and robust environmental protection for medium-power electronic devices.

Key Features

  • 1.0 W/m·K Thermal Conductivity: Efficient heat dissipation for medium-power electronic components including transformers, MOSFETs and power modules, maintaining optimal operating temperatures.
  • UL 94 V-0 Flame Retardancy: Certified flame retardant performance ensuring fire safety compliance for electronic products in automotive, industrial and consumer applications.
  • 1:1 Mixing Ratio: Simple two-part mixing with minimal measurement error, compatible with both manual pouring and automated dispensing equipment for production efficiency.
  • Superior Electrical Insulation: Volume resistivity ≥5.0*10^14 Ω·cm providing excellent dielectric protection, mitigating risk of short circuits and electrical leakage.
  • Wide Temperature Range -40°C to +150°C: Stable elastomer performance across extreme operating environments, from cold start conditions to sustained high-temperature operation.
  • Excellent Vibration and Moisture Resistance: Protects sensitive electronic assemblies from mechanical shock, dust ingress and humidity in harsh industrial environments.

Applications

  • Power Module Encapsulation: Protects DC/DC converters, AC/DC power supplies and voltage regulators through complete potting encapsulation, ensuring long-term reliability under thermal cycling.
  • Photovoltaic Inverter Potting: Provides critical environmental sealing for solar inverter electronics, protecting against outdoor exposure, temperature swings and condensation.
  • On-Board Charger (OBC) Protection: Encapsulates EV on-board charger electronics with vibration-resistant and thermally conductive protection for automotive-grade durability.
  • LED Driver Power Supply Potting: Enhances thermal management of LED driver circuits, extending luminaire service life and maintaining consistent light output.
  • Motor Stator Coil Potting: Protects motor windings and stator assemblies from moisture, dust and vibration in industrial motor and automotive applications.
  • Industrial Controller Sealing: Provides dust-proof, moisture-resistant encapsulation for PLC modules, sensors and industrial IoT devices operating in factory environments.

Technical Specifications

PropertySpecification
TypeTwo-Component Addition Cure Silicone
Thermal Conductivity1.0 W/m·K
Viscosity (After Mixing)2000-3000 mPa.s
Hardness45-50 Shore A
Mixing Ratio1:1 (A:B)
Volume Resistivity≥5.0*10^14 Ω·cm
Temperature Range-40°C to +150°C
Flame RetardancyUL 94 V-0
ColorGray/White

Packaging and Storage

  • Standard packaging: 50Kg/set (Component A 25Kg + Component B 25Kg)
  • Custom packaging configurations available for volume orders
  • Store in a cool, dry environment away from direct sunlight and moisture
  • Shelf life: 6 months in original sealed packaging

For bulk pricing on 1.0 W/mK thermally conductive flame retardant silicone potting compound, or to request technical datasheets and samples, please contact our engineering sales team. Custom thermal conductivity formulations and viscosity adjustments available upon request.

Send your message to this supplier
Send Now

1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation

Ask Latest Price
Mixing Ratio :
1:1 (A:B)
Color :
Gray/White
Temperature Range :
-40°C to +150°C
Viscosity :
2000-3000 mPa.s
Place of Origin :
Guangdong, China
Delivery Time :
3-5 working days for stock, 10-15 days for production
Contact Supplier
1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation
1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation
1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation
1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation
1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer, Agent, Trading Company
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement