1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for Electronic Component Encapsulation
The HN-8810A/B 1.0 W/mK Thermal Conductivity Silicone Potting Compound is a two-component addition-cure silicone system engineered for PCB power modules, LED drivers, and electronic component encapsulation. With UL 94 V-0 flame retardancy certification and 1.0 W/m·K thermal conductivity, this compound provides balanced heat dissipation, superior electrical insulation and robust environmental protection for medium-power electronic devices.
Key Features
- 1.0 W/m·K Thermal Conductivity: Efficient heat dissipation for medium-power electronic components including transformers, MOSFETs and power modules, maintaining optimal operating temperatures.
- UL 94 V-0 Flame Retardancy: Certified flame retardant performance ensuring fire safety compliance for electronic products in automotive, industrial and consumer applications.
- 1:1 Mixing Ratio: Simple two-part mixing with minimal measurement error, compatible with both manual pouring and automated dispensing equipment for production efficiency.
- Superior Electrical Insulation: Volume resistivity ≥5.0*10^14 Ω·cm providing excellent dielectric protection, mitigating risk of short circuits and electrical leakage.
- Wide Temperature Range -40°C to +150°C: Stable elastomer performance across extreme operating environments, from cold start conditions to sustained high-temperature operation.
- Excellent Vibration and Moisture Resistance: Protects sensitive electronic assemblies from mechanical shock, dust ingress and humidity in harsh industrial environments.
Applications
- Power Module Encapsulation: Protects DC/DC converters, AC/DC power supplies and voltage regulators through complete potting encapsulation, ensuring long-term reliability under thermal cycling.
- Photovoltaic Inverter Potting: Provides critical environmental sealing for solar inverter electronics, protecting against outdoor exposure, temperature swings and condensation.
- On-Board Charger (OBC) Protection: Encapsulates EV on-board charger electronics with vibration-resistant and thermally conductive protection for automotive-grade durability.
- LED Driver Power Supply Potting: Enhances thermal management of LED driver circuits, extending luminaire service life and maintaining consistent light output.
- Motor Stator Coil Potting: Protects motor windings and stator assemblies from moisture, dust and vibration in industrial motor and automotive applications.
- Industrial Controller Sealing: Provides dust-proof, moisture-resistant encapsulation for PLC modules, sensors and industrial IoT devices operating in factory environments.
Technical Specifications
| Property | Specification |
| Type | Two-Component Addition Cure Silicone |
| Thermal Conductivity | 1.0 W/m·K |
| Viscosity (After Mixing) | 2000-3000 mPa.s |
| Hardness | 45-50 Shore A |
| Mixing Ratio | 1:1 (A:B) |
| Volume Resistivity | ≥5.0*10^14 Ω·cm |
| Temperature Range | -40°C to +150°C |
| Flame Retardancy | UL 94 V-0 |
| Color | Gray/White |
Packaging and Storage
- Standard packaging: 50Kg/set (Component A 25Kg + Component B 25Kg)
- Custom packaging configurations available for volume orders
- Store in a cool, dry environment away from direct sunlight and moisture
- Shelf life: 6 months in original sealed packaging
For bulk pricing on 1.0 W/mK thermally conductive flame retardant silicone potting compound, or to request technical datasheets and samples, please contact our engineering sales team. Custom thermal conductivity formulations and viscosity adjustments available upon request.