Specifications
Viscosity B :
50 mPa·s
Volume Resistivity :
≥1×10^14 Ω·cm
Model Number :
HN-8808
Specific Gravity :
0.98
Operating Time at 25°C :
1-2 hours
Payment Terms :
T/T,L/C,PayPal,WU
Appearance :
Transparent / White / Grey liquid
Certification :
RoHS, REACH
MOQ :
1 Set
Viscosity A :
2000 mPa·s
Mixing Ratio :
10:1 (A:B by weight)
Hardness :
Shore A 25 (flexible gel)
Thermal Conductivity :
0.1-0.20 W/m·K
Temperature Range :
-57°C to 250°C
Supply Ability :
500 kg per Month
Dielectric Strength :
18-25 kV/mm
Dielectric Loss (1MHz) :
≤4×10^-3
Product Model :
HN-8808
Place of Origin :
Guangdong, China
Packaging Details :
10kg/20kg plastic barrel, Export-grade corrugated carton.
Brand Name :
Hanast
Curing Time at 25°C :
8-12 hours
Price :
Negotiable
Delivery Time :
3-5 working days for sample, 7-15 days for bulk order
Dielectric Constant (1MHz) :
2.5-3.0
Description
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808
HN-8808 is a transparent fast-curing two-component silicone potting compound optimized for IGBT power module encapsulation and high-voltage LED array protection. Achieves full cure in 8-12 hours at room temperature with a 1-2 hour pot life—balancing production speed with ample working time. The combination of 18-25 kV/mm dielectric strength, low 2.5-3.0 dielectric constant, and Shorre A 25 flexible stress relief makes it ideal for power semiconductor assemblies. Full ODM customization from our 40,000 m² Shenzhen facility.
Key Features
⚡ IGBT Module Optimized Insulation
Purpose-engineered for IGBT power module encapsulation where high dielectric withstand (18-25 kV/mm) and low dielectric loss (≤4×10⁻³ at 1 MHz) are critical. The low 2.5-3.0 dielectric constant minimizes parasitic capacitance and switching losses in high-frequency power conversion circuits, motor drives, and traction inverters.
⏱️ 8-12 Hour Fast Room Temp Cure
Full encapsulation cure in just 8-12 hours at ambient 25 °C—significantly faster than many competing 24+ hour formulations. This reduces work-in-progress inventory and accelerates production throughput. 1-2 hour pot life allows single-batch mixing for large or multiple IGBT module assemblies without rushing.
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Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection

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Viscosity B :
50 mPa·s
Volume Resistivity :
≥1×10^14 Ω·cm
Model Number :
HN-8808
Specific Gravity :
0.98
Operating Time at 25°C :
1-2 hours
Payment Terms :
T/T,L/C,PayPal,WU
Contact Supplier
video
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer, Agent, Trading Company
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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