HN-8808 is a premium two-part condensation-cure RTV-2 silicone potting compound formulated specifically for circuit board sealing and power supply waterproof protection. Its unique self-priming adhesion bonds directly to aluminum substrates, iron, acrylic, and PC plastics—eliminating the need for a separate primer step. With an exceptionally wide -57°C to 250°C temperature tolerance, non-toxic and odorless cure chemistry, and superior moisture resistance, HN-8808 is the proven choice for outdoor LED power supplies, automotive electronic modules, and industrial control board encapsulation.

Unlike conventional potting compounds that require a separate primer, HN-8808 delivers primerless adhesion to aluminum, iron, acrylic, and PC plastic substrates. This simplifies the PCB encapsulation workflow, eliminates an entire process step, and ensures robust waterproof sealing performance on aluminum-core LED boards and metal-housed power modules.

Maintains elastomeric properties across an industry-leading range of -57°C to 250°C. From arctic outdoor LED luminaires to high-temperature automotive under-hood ECU enclosures, HN-8808 delivers consistent dielectric protection, vibration damping, and adhesion integrity without embrittlement or thermal breakdown.

Neutral condensation cure releases no corrosive by-products, no pungent odors, and no volatile organic compounds during cross-linking. Safe for enclosed production environments and compliant with occupational health standards. Non-swelling formulation preserves dimensional stability of acrylic lenses and polycarbonate housings.

Exceptional moisture resistance with volume resistivity ≥5.0×10¹⁴ Ω·cm provides an effective humidity and condensation barrier for outdoor power supplies, LED street light drivers, and marine environment electronics. Maintains electrical isolation even under prolonged exposure to high-humidity and salt-spray conditions.

Cures at ambient temperature (25°C) via condensation cross-linking in 4-6 hours. No oven, no UV lamp, no external energy input required. The 40-60 minute working time provides comfortable pot life for both manual and automated dispensing. Cure speed can be tuned by adjusting the A:B ratio for production flexibility.

Dielectric strength of ≥14 kV/mm and a low dielectric constant of ≤3.5 ensures reliable insulation for high-voltage power supply circuits, AC-DC converter modules, and industrial control boards. Maintains stable dielectric properties under wet, humid, and thermally cycled conditions without degradation.

• Standard Packaging: 50kg/set (Component A 25kg + Component B 25kg) in sealed plastic drums
• Alternative Packaging: 40kg/set (Component A 20kg + Component B 20kg)
• Shelf Life: 6 months (best used within 3 months). Store sealed in a cool, dry environment
• Transport: Non-dangerous goods. Standard freight classification applies

1. Ensure substrate surfaces are clean, dry, and free from oil or flux residue. No surface primer is required for aluminum, iron, acrylic, or PC substrates.
2. Mix Component A and Component B at a 10:1 ratio by weight. Stir thoroughly until uniform color is achieved.
3. Optional: Vacuum degas the mixture for 5-10 minutes at -0.1 MPa to eliminate entrapped air bubbles.
4. Pour or dispense directly onto the circuit board or into the enclosure. The low 2000-2600 mPa·s viscosity ensures complete coverage of component topography.
5. Cure at room temperature (25°C) for 4-6 hours. Cure speed can be adjusted by altering the B component ratio.
6. Mixed material should be used within the 40-60 minute pot life window. Avoid heating to accelerate cure as this may introduce bubbles.

Hanast engineers can tailor viscosity, hardness, adhesion profile, thermal conductivity, and cure speed to meet your specific production requirements. Our 40,000 m² facility delivers multi-ton batches with consistent lot-to-lot quality. Custom sample formulations ready in 3-5 working days. Full MSDS and TDS included with every shipment.