Product Overview
This document details the specifications for the CMFA series Chip NTC Thermistors manufactured by Nanjing Shiheng Electronics Technology Co., Ltd. These thermistors are designed for various applications requiring precise temperature sensing and control. Key features include high accuracy, stable performance, and a wide operating temperature range. They are suitable for use in electronic circuits where temperature monitoring is critical.
Part Number: CMFA 503F3950
Date: 2021-08-21
| Parameter | Value | Unit |
|---|---|---|
| Nominal Resistance at 25 (R25) | 50 | k |
| B Constant (25/50) | 3950 | K |
| B Constant (25/85) | 3987 | K |
| Permissible Operating Current at 25 | 0.13 | mA |
| Dissipation Factor | 1.0 | mW/ |
| Thermal Time Constant | <5 | s |
| Rated Electric Power at 25 | 100 | mW |
| Operating Ambient Temperature | -40 to +125 |
| Type | L | W | T | a | A | B | C |
|---|---|---|---|---|---|---|---|
| [0603] | 0.063 0.006 [1.6 0.15] | 0.031 0.006 [0.8 0.15] | 0.031 0.006 [0.8 0.15] | 0.012 0.008 [0.3 0.2] | [0.6-0.8] | [0.6-0.7] | [0.6-0.8] |
| Code | Description |
|---|---|
| CMF | Type: Chip NTC Thermistor |
| A | External Dimensions (LW): 2.001.250.85 (for CMFA series) |
| 503 | Nominal Zero-Power Resistance at 25: 50k |
| F | Tolerance of Resistance: 1% |
| 3950 | B Value Constant: 3950K |
Standard Atmospheric Conditions:
- Ambient Temperature: 2015
- Relative Humidity: 6520%
- Air Pressure: 86 kPa to 106 kPa
Conditions for Disputed Results:
- Ambient Temperature: 252
- Relative Humidity: 655%
- Air Pressure: 86 kPa to 106 kPa
| Item | Standard | Requirements |
|---|---|---|
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage. |R25/R25| 5% |
| Vibration | IEC 60068-2-80 | No visible damage. |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage; Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage. |R25/R25| 5%; |B/B| 2% |
| Temperature Cycling | IEC 60068-2-14 | No visible damage. |R25/R25| 3%; |B/B| 2% |
| Resistance to Dry Heat | IEC 60068-2-2 | No visible damage. |R25/R25| 5%; |B/B| 2% |
| Resistance to Cold | IEC 60068-2-1 | No visible damage. |R25/R25| 5%; |B/B| 2% |
| Resistance to Damp Heat | IEC 60068-2-78 | No visible damage. |R25/R25| 3%; |B/B| 2% |
| Resistance to High Temperature Load | IEC 60539-1 5.25.4 | No visible damage. |R25/R25| 5%; |B/B| 2% |
| Type | Tape Thickness (mm) | Tape Material | Quantity per Reel |
|---|---|---|---|
| 0201 | 0.5 0.15 | Paper Tape | 15K |
| X | 0.5 0.15 | Paper Tape | 10K |
| A | 0.8 0.15 | Paper Tape | 4K |
| A | 0.85 0.2 | Paper Tape | 4K |
Re-flowing Profile:
- Ramp: 1~2/sec.
- Pre-heating: 150~170/9030 sec.
- Time above 240: 20~40 sec.
- Peak temperature: 260 Max./10 sec.
- Solder paste: Sn/3.0Ag/0.5Cu
- Max. 2 times for re-flowing
Iron Soldering Profile:
- Iron soldering power: Max. 20W
- Pre-heating: 150/60sec.
- Soldering Tip temperature: 280 Max.
- Soldering time: 3 sec Max.
- Solder paste: Sn/3.0Ag/0.5Cu
- Max. 1 time for iron soldering
[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]
| Temperature (C) | R_Min (Kohm) | R_Cent (Kohm) | R_Max (Kohm) | Res TOL. | Temp TOL.(C) |
|---|---|---|---|---|---|
| -40 | 1,649.637 | 1,726.374 | 1,806.500 | 4.64% | 0.67 |
| -39 | 1,543.253 | 1,613.954 | 1,687.726 | 4.57% | 0.66 |
| ... | ... | ... | ... | ... | ... |
| 25 | 49.500 | 50.000 | 50.500 | 1.00% | 0.23 |
| ... | ... | ... | ... | ... | ... |
| 125 | 1.631 | 1.705 | 1.781 | 4.47% | 1.77 |