This SAS 29-Pin Female Connector features a hybrid structure with 15-pin DIP through-hole terminals and 7-pin SMT pads, making it suitable for both high-strength PCB attachment and fine-pitch signal transmission.
The connector uses ≥30u" gold-plated contact terminals with ≥50u" nickel underplating, ensuring excellent conductivity, corrosion resistance, and long-term durability in high-speed SAS signal environments.

The housing and cap parts are made from high-temperature UL94-V0 LCP, providing superior dimensional stability during PCB reflow or hand soldering. With compliance to RoHS 2.0 + HF + REACH, this product is ideal for global electronics manufacturing.

Its mechanical robustness, low contact resistance, and hybrid mounting configuration make it an excellent choice for servers, storage devices, industrial control equipment, automotive electronics, and high-speed PCB designs.

Key Features

• Hybrid 15P DIP + 7P SMT design for optimized mechanical strength and electrical performance
• ≥30u" Gold-plated contact area ensuring stable high-speed signal transmission
• ≥80u" tin-plated solder areas for secure PCB soldering
• High-temperature UL94-V0 LCP housing, suitable for industrial and automotive applications
• Low contact resistance (≤30mΩ) and high insulation resistance (≥1000MΩ)
• Durable mechanical structure with 500 cycles (board) and 25 cycles (cable)
• Compliant with RoHS 2.0, Halogen-Free & REACH
• Fine pitch of 1.27mm supporting dense PCB designs
• Suitable for customization: pin count, plating thickness, mounting type, and application-specific features

⚙️ Applications

1. Server & Storage Devices

SAS HDD/SSD modules

RAID controller boards

Server backplanes

High-speed data transmission lines

2. Communication Equipment

Network routers and switches

Optical-electrical conversion modules

Edge computing devices

3. Automotive Electronics

ADAS data modules

In-vehicle storage interfaces

ECU signal connectors

4. Industrial Control Systems

PLC controllers

Industrial computers

Data acquisition boards

5. PCB & High-Speed Signal Designs

Multi-board connectivity

Fine-pitch high-density boards

High-speed signal routing applications

⚠️ Notes

• Ensure DIP through-hole pads and SMT pad patterns follow the recommended PCB layout.
• Use proper soldering temperatures to avoid LCP housing deformation.
• Avoid contamination of gold-plated terminals to maintain signal quality.
• Maintain ESD protection during handling and assembly.
• DIP pins must be fully inserted into PCB holes before soldering to avoid skew.
• Avoid mating with oxidized male connectors.
• Store connectors in dry, anti-static packaging.