Product Overview

This ceramic disc cleaning & waxing integrated machine combines one ceramic disc cleaner with dual ceramic disc mounters, designed for high-efficiency cleaning and wafer waxing in sapphire and semiconductor industries, achieving stable 99.9% yield rate.

Technical Specifications

Working Principle

Ceramic Disc Cleaning Stage

• Precision Cleaning: Utilizes ultrasonic cleaning with deionized water (≥12MΩ·cm) to remove micron-level contaminants from ceramic discs.

• Drying System: High-efficiency air knives and vacuum drying ensure zero residual moisture.

Automated Waxing Process

• Vision Alignment: CCD cameras scan disc surface coordinates, achieving ±0.02mm positioning accuracy.

• Controlled Wax Deposition: Programmable wax dispensing heads apply 0.8g±0.05g wax per wafer.

• Pressure Optimization: Pneumatic actuators maintain 5-10N/cm² uniform contact pressure during wafer mounting.

Integrated Control

• Synchronized Operation: PLC coordinates cleaning module and dual waxing stations, enabling parallel processing (Max. 30 discs/hour).

• Quality Feedback: Real-time thickness sensors detect wax layer uniformity, automatically adjusting parameters if deviations exceed ±3%.

Key Advantages

• Energy Efficiency: Pure water recycling rate >80%, wax consumption 0.8g/wafer, 35% lower energy per disc

• Smart Connectivity: Compatible with MES/ERP for full-process data traceability (thickness/pressure/time)

• Scalability: Customizable tooling and recipes for Φ300-650mm non-standard discs

Production Capacity

Applications

Full-process ceramic disc treatment: Cleaning→Drying→Waxing in one machine

It is used in the processing of semiconductor materials such as silicon carbide (SiC), silicon (Si), gallium nitride (GaN), and can also be used for materials such as sapphire, ceramics, crystal, MEMS, and optical products.

Q&A

Q1: How to ensure yield rate?
A1: Dedicated vision system for ceramic discs achieves ±0.02mm real-time alignment accuracy.

Q2: Water consumption of ceramic disc cleaning?
A2: Water recycling rate >80%, consumption ≤0.5L/disc.

Q3: How to achieve rapid wafer size changeover?
A3: The integrated machine's smart fixture library automatically switches tooling via HMI selection (Changeover time <3min).