High-Precision Wire Saw JSZ1231D

Product Overview

The JSZ1231D High-Precision Wire Saw is designed for precision slicing applications in the semiconductor industry. It is suitable for high-efficiency, high-accuracy slicing of semiconductor ingots and other hard and brittle materials.

The machine features a high-rigidity integrated structure, high-speed main roller drive system, precise wire tension control, hydraulic workpiece clamping, and a stable control system. It supports a maximum wire speed of up to 2,200 m/min, cutting accuracy of ±0.01 mm, and a minimum slice thickness of less than 0.05 mm, making it suitable for semiconductor wafer processing where precision, stability, and material utilization are critical.

Main Technical Specifications

• Maximum workpiece size: W90 × H220 × L450 mm
• Maximum workpiece length: 450 mm
• Maximum wire speed: 2,200 m/min
• Maximum wire storage capacity: 100 km
• Wire diameter range: 0.014–0.1 mm
• Wire tension control range: 0–15 N
• Feed stroke: ≤220 mm
• Cutting feed speed: 0.01–5 mm/min, adjustable
• Rapid feed speed: 200 mm/min
• Slurry tank capacity: 300 L
• Workpiece clamping: Automatic hydraulic clamping
• Maximum main roller speed: <4,500 rpm
• Maximum main roller diameter: Ø160 mm
• Main rollers: 3 pcs + 3 spare pcs
• Cutting mode: Downward feed
• Wire running mode: Reciprocating or one-way operation
• Power supply: Three-phase four-wire AC 380V ±10%, 50/60 Hz
• Machine dimensions: Approx. L1750 × W1600 × H2900 mm
• Machine weight: Approx. 8 tons

Key Advantages

The machine adopts a compact structural design with a relatively small footprint. The machine body is made of high-strength steel, while the base uses an integrated casting structure to improve overall rigidity and long-term operational stability.

All major drive systems use direct-drive structures, helping reduce transmission errors and mechanical wear while providing lower operating noise and higher drive accuracy.

Each of the three main rollers is independently driven by a direct-drive motor. This design reduces the load caused by the wire pulling the rollers, helping reduce wire breakage as well as roller groove wear and wire consumption.

The machine features a shortened shaft spacing of approximately 270 mm, which improves wire stability during cutting and helps enhance cutting yield while reducing cutting time and wire consumption.

Dual-side wire breakage detection improves alarm sensitivity. The electrical control system also includes power-loss protection to help reduce wire breakage and workpiece scrap caused by unexpected power interruptions.

With a maximum wire speed of 2,200 m/min and precise tension control, the machine is suitable for fine-wire cutting processes while maintaining stable wire operation.

Cutting accuracy can reach ±0.01 mm, while the minimum slice thickness is less than 0.05 mm, meeting the requirements of high-precision semiconductor wafer slicing.

Main System Components

The machine mainly consists of:

• Wire spool unit for wire supply and storage
• Wire traversing unit for smooth unwinding and uniform rewinding
• Tension control unit for maintaining stable wire tension
• Guide wheel system for accurate and smooth wire guidance
• Main spindle and roller unit for precision slicing
• Feed unit for workpiece fixing and controlled cutting movement
• Heat exchanger for cutting fluid temperature control
• Slurry and cooling system
• Electrical control cabinet
• Human-machine interface for parameter setting, operation, and status monitoring

Precision and Acceptance Criteria

• Main roller runout: ≤0.02 mm
• Radial runout of spindle box taper surface: ≤0.005 mm
• Axial runout of spindle shaft: ≤0.005 mm
• Contact ratio between spindle taper and taper hole: ≥70%
• Vertical feed straightness: ≤0.005 mm/150 mm
• Wire twist: Less than 5 turns per meter
• Supply/take-up spindle vibration: ≤5 m/s²
• Supply/take-up wheel runout: ≤0.15 mm

Operating Environment

• Recommended ambient temperature: 18–28°C
• Relative humidity: ≤75%
• Environmental vibration: ≤0.5G
• Cooling water temperature: 11 ±1°C
• Cooling water flow: 20–50 L/min
• Cooling water pressure: 0.2–0.4 MPa
• Required cooling capacity: ≥5 kW
• Actual machine power consumption: approximately 5 kWh

Applications

The machine is mainly used for precision slicing of semiconductor wafers and other hard and brittle materials. It is particularly suitable for applications requiring thin slicing, high cutting accuracy, stable wire operation, low wire breakage, and improved material utilization.

Short Product Description for Website / Catalog

JSZ1231D High-Precision Wire Saw

Designed for precision semiconductor wafer slicing, the JSZ1231D supports fine wire diameters from 0.014 to 0.1 mm and a maximum wire speed of 2,200 m/min. Its high-rigidity structure, independently driven main rollers, precise tension control, and automatic hydraulic clamping provide stable and accurate cutting performance.

The machine supports workpieces up to 450 mm in length, achieves cutting accuracy of ±0.01 mm, and can produce slices thinner than 0.05 mm. Dual-side wire breakage detection, temperature-controlled cutting fluid, and a stable electrical control system make it suitable for reliable and efficient semiconductor material processing.