| 1.Designed to support application,such as SOHO(ADSL | ![]() | ||
| modems),LAN-on-Motherboard(LOM),hub and Switches. | |||
| 2.Meets IEEE 802.3af specification | |||
| 3.Connector Materials: | |||
| Housing: Thermoplastic PBT+30%G.F UL94V-0 | |||
| Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm | |||
| Pins: Brass C2680R-H Thickness=0.35mm | |||
| Shield: SUS 201-1/2H Thickness=0.2mm | |||
| Contact plating: Gold 6 micro-inches min.In contact area. | |||
| 4.Wave solder tip temperature: 265℃ Max, 5 Sec Max | |||
| 5.UL Certification: File Number E484635 | |||