Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RF-60TC
PCB Thickness :
10mil
PCB size :
49.44 mm x 36.88 mm ± 0.15 mm
Copper weight :
1OZ
Surface finish :
Immersion Tin
Description

We are excited to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-60TC, a high-frequency laminate designed for high-power RF and microwave applications. This advanced material combines ceramic-filled, glass-reinforced PTFE with exceptional thermal conductivity, making it ideal for miniaturized antenna designs and other high-efficiency applications.

Key Features

RF-60TC boasts a dielectric constant (Dk) of 6.15 at 10 GHz and a low dissipation factor of 0.002, providing improved gains and efficiencies in RF circuits. Its high thermal conductivity—1.0 W/m*K for 0.5 oz copper and 1.05 W/m*K for 1 oz—ensures effective heat dissipation, reducing operating temperatures and enhancing the reliability of active components. Additionally, RF-60TC has a low moisture absorption rate of 0.03% and a thermal coefficient of Dk of -3.58 ppm/°C, ensuring stable performance across a wide temperature range.

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 6.15 ± 0.15 6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 0.002 0.002
TcK ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19 0.155 0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94 V-0 V-0

PCB Specifications

This PCB features a robust stackup consisting of:

- Copper Layer 1: 35 μm
- RF-60TC Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm

The overall dimensions of the PCB are 49.44 mm x 36.88 mm ± 0.15 mm, with a finished thickness of 0.37 mm. It supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.25 mm. The PCB is designed without blind vias, featuring a finished copper weight of 1 oz (1.4 mils) on both outer layers.

For surface finish, the PCB uses immersion tin, and it has a white silkscreen on the top side, while the bottom remains clear of silkscreen and solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure optimal performance.

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Applications

This versatile PCB is suitable for a range of applications, including:

- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID Readers
- Filters, Couplers, and Dividers
- Satellite Components

Quality Assurance and Availability

This PCB is produced in accordance with IPC-Class 2 standards and is available for global shipping. The artwork is supplied in Gerber RS-274-X format, ensuring it is compatible with standard PCB design workflows.

Utilizing RF-60TC material allows you to attain superior performance and reliability in high-frequency applications, making it an ideal option for sophisticated RF circuit designs.

RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board

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RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board

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Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board
RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board
RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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