This PCB ranks as a 20-layer high-density interconnect circuit board with TU-872 SLK modified epoxy FR4 dielectric featuring a TG200 rating. An asymmetric copper configuration consists of 0.5oz inner copper and 1oz outer copper, with the finished board thickness reaching 3mm. Double-sided green solder mask paired with white silkscreen covers the board surface, while premium nickel-palladium-gold surface treatment ensures steady surface conductivity. In line with rigorous IPC-Class-3 criteria, this advanced laser-based HDI PCB integrates precision impedance circuits and fully resin-filled vias. Boasting reliable dimensional stability, this low-loss high-speed circuit board fits seamlessly into high-performance computing hardware, telecommunication base stations and high-frequency server frameworks.

PCB Specifications

Artwork Format & Compliance Standard

Artwork Format: Provided in Gerber RS-274-X, the universal industrial format for high-precision HDI multilayer boards.

Quality Grade: IPC-Class-3, the highest industrial benchmark for high-reliability electronic equipment.

Availability: Supports global shipping to meet demand in various countries.

Introduction of TU-872 SLK Substrate

TU-872 SLK is a premium modified epoxy FR4 dielectric built with high-end resin formulation and reinforced with standard woven E-glass fiber. This low-loss material holds a low dielectric constant and a low dissipation factor, catering to high-speed digital transmission and multi-layer high-frequency circuitry. It maintains great compatibility with lead-free eco-friendly processes and conventional FR4 workflows, granting strong adaptability for complex multi-layer lamination structures.

TU-872 SLK possesses superior physical and chemical traits, including remarkable moisture resistance, optimized Z-axis thermal expansion, stable chemical inertness and steady thermal performance. Incorporated allyl network compounds enhance structural toughness and dependable CAF resistance. Consistent Dk/Df values sustain stable electrical performance across varying frequency spectrums, rendering this substrate a trustworthy option for high-end computing and communication hardware.

Key Material Features

Performance and Processing Advantages

Uniform low Dk/Df electrical properties for reliable high-speed and high-frequency operation

Refined Z-axis thermal expansion curbs thermal deformation during lamination cycles

Reliable CAF resistance prevents conductive anodic filament corrosion failure

Strong moisture tolerance for deployment within humid and harsh working environments

Excellent dimensional uniformity, consistent thickness and superior flatness

Dependable mechanical endurance for through-hole architecture and soldering procedures

Full compatibility with lead-free assembly and mainstream FR4 processing workflows

Typical Applications for TU-872 SLK

TU-872 SLK serves as a high-speed low-loss dielectric well-suited for premium commercial communication and computing infrastructure:

-Radio frequency circuitry and high-frequency signal processing modules

-Backplane boards and motherboards for high-performance computing systems

-Communication line cards and industrial data storage equipment

-Server main-boards and telecommunication base station hardware

-Office network routers and broadband signal transmission facilities