This 16-layer PCB is fabricated using S1000-2M laminate (TG 180°C) with 3oz heavy copper per layer, achieving a pressed thickness of 6.7mm. It features Lead-Free Hot Air Solder Leveling (HASL) surface finish, blue solder mask with white silkscreen. S1000-2M FR-4 material endows the PCB with excellent environmental resistance and processibility, while 3oz heavy copper enhances current-carrying capacity and heat dissipation. It meets the performance requirements of high-layer count, high-power electronic systems in computing, communication, and automotive electronics fields.

PCB Specifications

S1000-2M Laminate Features

S1000-2M is a high-performance FR-4 laminate with TG 180°C, designed for high-layer count PCBs and lead-free manufacturing processes. Its core features are as follows:

-Enhanced Through-Hole Reliability: Lower Z-axis coefficient of thermal expansion (CTE) reduces thermal stress on plated through-holes, ensuring stable interconnection performance even under thermal cycling.

-Superior Environmental Resistance: Excellent Pressure Cooker Test (PCT) performance and low water absorption enable high heat and humidity resistance, adapting to harsh operating environments.

-Excellent Processibility & Thermal Stability: Good mechanical processibility facilitates precision machining of high-layer count PCBs, while high thermal resistance meets lead-free soldering temperature requirements (compatible with lead-free processes).

-Broad Application Versatility: Ideal for high-layer count PCBs, widely used in computing, communication, automotive electronics, and other high-reliability electronic systems.

What is Heavy Copper?

Heavy copper refers to copper layers with a finished weight of 2oz (70μm) or more, and 3oz (105μm) copper is a typical specification for heavy copper PCBs. Unlike standard copper layers (0.5oz-1oz), heavy copper is manufactured through specialized electroplating and pressing processes to achieve greater thickness, balancing current-carrying capacity and structural stability.

Functions of Heavy Copper

-High Current-Carrying Capacity: The increased copper thickness reduces resistance, enabling the PCB to carry higher current without excessive heating, which is critical for high-power electronic devices.

-Efficient Heat Dissipation: Copper has excellent thermal conductivity; thicker copper layers accelerate heat transfer from components to the PCB, reducing thermal accumulation and extending device service life.

-Enhanced Mechanical Strength: Heavy copper layers improve the PCB’s structural rigidity and durability, enhancing resistance to thermal fatigue and mechanical stress, especially suitable for high-layer count and high-reliability applications.

-Stable Signal Integrity: For high-power and high-frequency circuits, heavy copper minimizes signal attenuation and voltage drop, ensuring stable signal transmission.

Application Fields of Heavy Copper

3oz heavy copper PCBs, combined with S1000-2M laminate, are widely used in fields requiring high current, high heat dissipation, and high reliability:

-Automotive Electronics: Power control modules, engine management systems, electric vehicle (EV) battery management systems (BMS), and on-board charging systems.

-Industrial Control: Industrial power supplies, motor drives, inverter circuits, and heavy-duty industrial control equipment.

-Communication Equipment: High-power RF amplifiers, base station power modules, and communication power supplies.

-Medical Devices: High-power medical equipment (e.g., diagnostic instruments, therapeutic devices) requiring stable performance and low thermal drift.

-Renewable Energy: Solar inverters, wind power control systems, and energy storage equipment.

Application Scope of S1000-2M PCB

With the synergistic advantages of S1000-2M laminate and 3oz heavy copper, this product is well-suited for high-power, high-reliability electronic systems in computing, communication, automotive electronics, industrial control, and other fields.