This PCB employs Rogers CLTE-AT as its base material, features an Immersion Gold surface finish, and strictly complies with IPC-Class-2 quality standards. It adopts a double-sided rigid structure, engineered to fulfill the high-performance requirements of RF, microwave, and phase-sensitive electronic systems. The Immersion Gold finish delivers exceptional corrosion resistance, solderability, and long-term reliability, making it well-suited for precision assembly processes.

PCB Construction Details

Stack-up Configuration

Rogers CLTE-AT Material Introduction

Rogers CLTE-AT laminates serve as the commercial-grade solution in the CLTE™ product line, adopting core technologies from CLTE-XT™ laminates with cost-optimized modifications. This results in a dielectric constant of 3.00 and a unique thickness profile compared to CLTE-XT variants. As micro-dispersed ceramic PTFE composites, CLTE-AT laminates integrate woven fiberglass reinforcement to achieve outstanding dimensional stability—a critical attribute for complex assemblies, particularly with thin substrates (0.005” and 0.010”).

CLTE-AT laminates deliver best-in-class insertion loss (S21) and a low loss tangent (0.0013) in the commercial market, second only to CLTE-XT. They achieve superior peel strength without relying on the lossier, rougher copper surfaces used in competing products. Furthermore, CLTE-AT features low CTE across XYZ axes and extremely low TCEr, ensuring electrical phase stability, Dk stability, and mechanical stability over an operating temperature range of -55°C to 150°C. It retains the competitive advantages of CLTE laminates, including minimal moisture and process chemical absorption, ease of processability, and enhanced thermal conductivity for improved heat transfer and power handling capabilities.

CLTE-AT Material Features

CLTE-AT Material Benefits

-Exceptional Mechanical Stability: CLTE-AT possesses superior mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.

-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication procedures.

-Optimized Copper Adhesion: It achieves excellent peel strength without relying on lossier, rougher copper surfaces, preserving signal integrity while ensuring reliable copper bonding.

-Easy Processability: Compatible with standard PCB manufacturing processes, eliminating the need for specialized techniques and reducing production complexity.

Typical Applications

-Automotive Radar & Adaptive Cruise Control Applications

-Microwave/RF Applications

-Phase/Temperature Sensitive Antennas

-Phase Sensitive Electronic Applications

-RF and Microwave Filters

Quality & Availability

This PCB complies with IPC-Class-2 quality standards, ensuring reliable performance for commercial and industrial electronics. It is available for worldwide supply, supporting global projects and timely international delivery.