This custom single-layer rigid high-frequency PCB utilizes Rogers TMM10 thermoset microwave composite laminate, delivering combined advantages of ceramic and PTFE substrates with improved manufacturability. It features solder mask-free and silkscreen-free construction with OSP surface finish, all units are 100% electrically tested before delivery to ensure reliable structural integrity and stable RF/microwave performance for precision high-frequency applications.

PCB Specifications

PCB Layer Stack-up Structure

Artwork & Quality Compliance

Artwork Format: Manufactured with standard Gerber RS-274-X data for precise patterning and universal process compatibility.

Quality Compliance: Fully compliant with IPC-Class-2 criteria to ensure consistent electrical performance and structural reliability.

Global Supply Capability: Supports worldwide delivery to serve global high-frequency PCB applications.

Rogers TMM10 Material Profile

Rogers TMM10 is a high-performance thermoset microwave composite dielectric laminate. It integrates the superior characteristics of traditional PTFE and ceramic substrates while eliminating the inherent mechanical limitations and complicated processing workflows of conventional high-frequency materials. This material delivers outstanding electrical stability, reliable mechanical robustness and simplified manufacturability, making it ideal for diverse high-precision microwave circuit designs.

Material Advantages

Superior Mechanical Stability: Resists creep and cold flow under continuous operating stress, maintaining accurate circuit geometry and stable high-frequency performance long-term.

Excellent Chemical Compatibility: Tolerates standard PCB processing chemicals, minimizing substrate damage and optimizing fabrication yield and quality stability.

Simplified Plating Process: Eliminates sodium napthanate pre-treatment for electroless plating, streamlining fabrication and reducing production costs.

High Wire-Bonding Reliability: Stable thermoset resin structure enables dependable wire-bonding capability for high-end precision packaging applications.

Typical Application Fields

Combining high dielectric constant, ultra-low high-frequency loss, copper-matched thermal expansion and superior process adaptability, Rogers TMM10-based PCBs are widely applied in high-precision microwave and satellite communication systems:

• High-precision semiconductor chip testing equipment
• Microwave dielectric polarizer components
• Satellite communication system modules
• GPS antennas, patch antennas and high-frequency antenna systems