This high-performance 3-layer rigid PCB is meticulously designed to meet the demanding requirements of various advanced electronic applications. With board dimensions of 98mm x 30mm (1 piece), it boasts precise construction details that ensure reliability and functionality.

PCB Specification

PCB Stack-up

The 3-layer rigid PCB has a well-engineered stack-up as follows:

Artwork and Standards

Type of Artwork from customers: Gerber RS-274-X, a widely accepted format for PCB manufacturing data.

PCB Standard: Complies with IPC-Class-2, ensuring good quality and reliability for general electronic products.

Availability

This PCB is available worldwide, making it accessible for various global projects.

Introduction to RO3006

Rogers RO3006 laminates are ceramic-filled PTFE composites that offer exceptional electrical and mechanical stability. They are specifically designed for use in commercial microwave and RF applications. These advanced circuit materials provide a stable dielectric constant (Dk) over a range of temperatures, eliminating the step change in Dk that occurs for PTFE glass materials near room temperature.

Features of RO3006

-Ceramic-filled PTFE composites.

-Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C.

-Dissipation factor of 0.002 at 10 GHz/23°C, ensuring minimal signal loss.

-Td> 500°C, indicating high thermal resistance.

-Thermal Conductivity of 0.79 W/mK, facilitating efficient heat dissipation.

-Moisture Absorption of 0.02%, making it highly resistant to moisture-related issues.

-Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C, ensuring dimensional stability across a wide temperature range.

Benefits of RO3006

• Uniform mechanical properties for a range of dielectric constants, making it ideal for multi-layer board designs with varying dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.

• Low in-plane expansion coefficient (matching copper), allowing for more reliable surface mounted assemblies, making it ideal for applications sensitive to temperature change and providing excellent dimensional stability.

• Volume manufacturing process with economical laminate pricing, ensuring cost-effectiveness for large-scale production.

Typical Applications

This PCB, with its use of RO3006, is well-suited for a variety of applications, including:

-Automotive radar applications.

-Global positioning satellite antennas.

-Cellular telecommunications systems - power amplifiers and antennas.

-Patch antenna for wireless communications.

-Direct broadcast satellites.

-Datalink on cable systems.

-Remote meter readers.

-Power backplanes.

Conclusion

This PCB, combining RO3006 and FR-4 materials with a 3-layer stack-up and precise craftsmanship, excels in high-frequency stability, heat dissipation, and dimensional control. It ensures quality through comprehensive electrical testing, making it a practical choice with both performance and reliability for various precision electronic applications.