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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating
Double-layer 1.6mm TMM4 PCB Silver and Gold Plating
Specifications
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
Rogers TMM4
Layer count :
2 layers
PCB thickness :
1.6mm
PCB size :
47mm x 118mm (1 piece)±0.15mm
Silkscreen :
White
Solder mask :
Green
Copper weight :
1oz (equivalent to 1.4 mils / 35 μm per layer)
Surface finish :
Silver and Gold Plating (Gold over Silver)
Description
Double-layer 1.6mm TMM4 PCB Silver and Gold Plating
This high-performance 2-layer PCB is built with Rogers TMM4--a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.
PCB Specification
Parameter Details
Base Material Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count 2-layer rigid PCB
Board Dimensions 47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.35mm
Via Type No blind vias (thru-hole vias only)
Finished Board Thickness 1.6mm
Finished Copper Weight (Outer Layers) 1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness 20 μm
Surface Finish Silver and Gold Plating (Gold over Silver) - ensures corrosion resistance, reliable soldering, and long-term contact performance
Silkscreen Top: White; Bottom: No
Solder Mask Top: Green; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up Details
Layer Type Material/Description Thickness
Copper Layer 1 (Outer) Conductive copper (finished) 35 μm (1oz)
Dielectric Core Rogers TMM4 1.524 mm (60 mils)
Copper Layer 2 (Outer) Conductive copper (finished) 35 μm (1oz)
Double-layer 1.6mm TMM4 PCB Silver and Gold Plating
Material Overview: Rogers TMM4
Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials--offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4's thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.
Key Material Features
Specification Value
Material Type Ceramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk) 4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz 0.0020
Thermal Coefficient of Dk (TCDk) 15 ppm/°K
Coefficient of Thermal Expansion (CTE) X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA) 425 °C
Thermal Conductivity 0.7 W/mK
Moisture Absorption 0.07% - 0.18%
Available Thickness Range 0.0015 - 0.500 inches (±0.0015 inches)
CTE Compatibility Matched to copper
Core Benefits
  • Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
  • Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
  • Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation--critical for high-precision RF/microwave components.
  • High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
  • Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
  • Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.
Typical Applications
This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:
  • RF and Microwave Circuitry
  • Power Amplifiers and Combiners
  • Filters and Couplers
  • Satellite Communication Systems
  • Global Positioning Systems (GPS) Antennas
  • Patch Antennas
  • Dielectric Polarizers and Lenses
  • Chip Testers
Double-layer 1.6mm TMM4 PCB Silver and Gold Plating
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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-332.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

Bicheng Electronics Technology Co., Ltd

Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, Taconic PCB
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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