Taconic 31mil TLX-8 PCB 2-layer Immersion Gold
This high-reliability 2-layer PCB leverages Taconic TLX-8, a top-tier PTFE fiberglass laminate specifically crafted for robust RF and microwave operations. Engineered to withstand harsh conditions--ranging from intense vibrations to radiation exposure and extreme temperature fluctuations--it boasts exceptional Passive Intermodulation (PIM) performance, consistent dielectric characteristics, and superior dimensional stability, fully complying with IPC-Class-2 quality benchmarks.
PCB Specification
| Parameter |
Details |
| Base Material |
Taconic TLX-8 (PTFE fiberglass laminate) |
| Layer Count |
2-layer rigid PCB |
| Board Dimensions |
25mm x 71mm (1 piece)±0.15mm |
| Minimum Trace/Space |
4/6 mils |
| Minimum Hole Size |
0.3mm |
| Via Type |
No blind vias (thru-hole vias only) |
| Finished Board Thickness |
0.8mm |
| Finished Copper Weight (Outer Layers) |
1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Gold - ensures corrosion resistance, reliable soldering, and long-term contact integrity |
| Silkscreen |
Top: White; Bottom: No |
| Solder Mask |
Top: No; Bottom: No |
| Quality Assurance |
100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type |
Material/Description |
Thickness |
| Copper Layer 1 (Outer) |
Conductive copper (finished) |
35 μm (1oz) |
| Dielectric Core |
Taconic TLX-8 |
0.787 mm (31 mils) |
| Copper Layer 2 (Outer) |
Conductive copper (finished) |
35 μm (1oz) |
Material Overview: Taconic TLX-8
Taconic TLX-8 is a versatile PTFE fiberglass laminate designed for high-volume antenna and microwave applications, where reliability in extreme environments is critical. Its formulation balances mechanical reinforcement (from fiberglass) with the low-loss properties of PTFE, making it suitable for low-layer-count designs that endure harsh conditions--including high vibration (e.g., space launch), extreme temperatures (e.g., engine modules, altimeters), radiation (e.g., space systems), and marine exposure (e.g., warship antennas). With a wide range of available thicknesses and copper cladding options, it offers flexibility for diverse RF/microwave design needs while maintaining tight control over dielectric properties.
Main Material Properties
| Property Category |
Specification |
Value |
Test Standard |
| Electrical Properties |
Dielectric Constant (Dk) @ 10 GHz |
2.55 ± 0.04 |
IPC-650 2.5.5.3 |
| Dissipation Factor (DF) @ 10 GHz |
0.0018 |
IPC-650 2.5.5.5.1 |
| Surface Resistivity (Elevated Temp.) |
6.605 x 10⁸ Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Surface Resistivity (Humidity Cond.) |
3.550 x 10⁶ Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Elevated Temp.) |
1.110 x 10¹⁰ Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Humidity Cond.) |
1.046 x 10¹⁰ Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
| Electrical Properties |
Dielectric Breakdown |
>45 Kv |
IPC-650 2.5.6 |
| Dimensional Stability |
MD After Bake |
0.06 mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.4 |
| CD After Bake |
0.08 mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.4 |
| MD Thermal Stress |
0.09 mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.5 |
| CD Thermal Stress |
0.10 mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.5 |
| Thermal Properties |
CTE (25-260 °C) - X-axis |
21 ppm/°C |
IPC-650 2.4.41 / ASTM D 3386 |
| CTE (25-260 °C) - Y-axis |
23 ppm/°C |
IPC-650 2.4.41 / ASTM D 3386 |
| CTE (25-260 °C) - Z-axis |
215 ppm/°C |
IPC-650 2.4.41 / ASTM D 3386 |
| Decomposition Temp. (Td) - 2% Weight Loss |
535 °C |
IPC-650 2.4.24.6 (TGA) |
| Decomposition Temp. (Td) - 5% Weight Loss |
553 °C |
IPC-650 2.4.24.6 (TGA) |
| Chemical/Physical Properties |
Moisture Absorption |
0.02% |
IPC-650 2.6.2.1 |
| Flammability Rating |
UL 94 V-0 |
UL-94 |
Core Benefits
- Exceptional PIM Performance: Measures lower than -160 dBc*, critical for minimizing signal interference in RF/microwave systems (e.g., radar, mobile communications).
- Extreme Environment Resistance: Withstands high vibration, extreme temperatures, radiation, and marine exposure--ideal for space, aerospace, and naval applications.
- Stable Electrical Properties: Low and tightly controlled Dk (2.55 ± 0.04) and low DF (0.0018) ensure consistent signal integrity across wide frequency ranges.
- Dimensional Stability: Minimal expansion/contraction under thermal stress or baking prevents PCB warpage, preserving component alignment and connection reliability.
- Low Moisture Absorption: 0.02% absorption eliminates moisture-related performance degradation, even in humid environments.
- Mechanical Robustness: Fiberglass reinforcement provides durability for designs requiring structural resilience (e.g., bolted PCBs in launch vehicles).
- UL 94 V-0 Rating: Enhances safety by resisting flame spread, suitable for critical systems where fire risk mitigation is key.
Typical Applications
This PCB is optimized for high-reliability RF/microwave systems, including:
- Radar systems
- Mobile communications equipment
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, and amplifiers
- Antennas (e.g., space, naval, aerospace)