Rogers RO3010 PCB 25mil Thick Double-layer pcb Board
Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010--a ceramic-filled PTFE composite material--to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.
PCB Specification
| Parameter |
Specification |
| Layer Count |
2-layer rigid PCB |
| Base Material |
Rogers RO3010 (ceramic-filled PTFE composite) |
| Board Dimensions |
45mm x 65mm (1 piece) |
| Finished Board Thickness |
0.8mm |
| Finished Copper Weight (Outer Layers) |
1oz (1.4 mils / 35μm) |
| Via Plating Thickness |
20μm |
| Minimum Trace/Space |
4 mils / 4 mils |
| Minimum Hole Size |
0.3mm |
| Vias |
12 total (no blind vias) |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Top: Black; Bottom: No |
| Solder Mask |
Top: No; Bottom: No |
| Quality Assurance |
100% Electrical test prior to shipment |
PCB Stack-up (Top to Bottom)
| Layer Sequence |
Layer Type |
Specification |
Thickness |
| 1 |
Copper Layer (Top - L1) |
Copper_layer_1 |
35μm (1oz) |
| 2 |
Substrate |
Rogers RO3010 |
0.635mm (25mil) |
| 3 |
Copper Layer (Bottom - L2) |
Copper_layer_2 |
35μm (1oz) |
Rogers RO3010 Material Overview
Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization-- a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.
Key Features of Rogers RO3010
| Property |
Specification |
| Dielectric Constant (Dk) |
10.2 ±0.30 (10GHz/23°C) |
| Dissipation Factor (Df) |
0.0022 (10GHz/23°C) |
| Coefficient of Thermal Expansion (CTE) |
X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C) |
| Thermal Decomposition Temperature (Td) |
>500°C |
| Thermal Conductivity |
0.95 W/mK |
| Moisture Absorption |
0.05% |
| Operating Temperature Range |
-40°C to +85°C |
| Quality Certification |
ISO 9001 Certified |
Core Benefits of Rogers RO3010
- Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
- Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
- Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
- Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
- Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.
Typical Applications
This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:
- Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
- Global Positioning System (GPS) antennas
- Cellular telecommunications systems (power amplifiers, antennas)
- Patch antennas for wireless communications
- Direct broadcast satellite (DBS) equipment
- Cable system datalinks
- Remote meter readers
- Power backplanes
Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.