This 2-layer (double-sided) rigid PCB serves high-power RF and microwave applications. By utilizing Rogers RT/duroid 6035HTC, a ceramic-filled PTFE composite, it achieves excellent thermal management and signal integrity. Each construction aspect, from material choice to surface finish, is optimized for high-power operation, guaranteeing reliability in challenging scenarios such as amplifiers and power dividers. Key specifications are as follows:

1.PCB Specifications

2. PCB Stack-up Configuration

3. Quality & Global Compliance

Artwork Format: Gerber RS-274-X (the universal industry standard)

Quality Standard: IPC-Class-2 compliant (meets commercial/industrial reliability requirements for high-power systems)

Availability: Globally accessible, supporting timely production in markets worldwide.

4. Rogers RT/duroid 6035HTC Material Introduction

Rogers RT/duroid 6035HTC is a premium high-frequency circuit material tailored for high-power RF and microwave applications.

A standout attribute is its superior thermal conductivity—almost 2.4 times that of standard RT/duroid 6000-series materials—enabling efficient dissipation of heat generated by high-power components (e.g., amplifiers). It also features copper foil (ED and reverse treat) with excellent long-term thermal stability.

Additionally, its advanced filler system delivers excellent drillability, reducing manufacturing costs compared to high-thermal-conductivity laminates that use alumina fillers.

5. RT/duroid 6035HTC Key Features

The material’s features are engineered to excel in high-power environments, balancing thermal resilience with signal integrity:

6. Material Benefits

The use of RT/duroid 6035HTC translates to tangible advantages for high-power applications, addressing key pain points like overheating and signal loss:

-Superior Thermal Management: High thermal conductivity (1.44 W/m/K) and improved dielectric heat dissipation lower operating temperatures for high-power components, extending their lifespan and reducing performance degradation.

-Excellent High-Frequency Performance: Low dissipation factor (0.0013 at 10GHz) minimizes insertion loss, preserving signal strength even in high-power, high-frequency circuits (e.g., microwave amplifiers).

-Thermal Stability: Copper foil with long-term thermal stability and controlled CTE (matched to circuit requirements) prevents trace cracking or delamination under thermal cycling—critical for reliable high-power operation.

-Manufacturing Efficiency: Advanced filler system enables easy drillability, reducing production time and costs compared to other high-thermal-conductivity laminates.

-Safety & Compliance: UL 94-V0 flammability rating and lead-free compatibility meet global safety and environmental standards.

7. Typical Applications

This PCB is ideally suited for the following applications:

-High-Power RF/Microwave Amplifiers: Requires efficient heat dissipation and low signal loss to maintain output power and reliability.

-Power Management Components: Couplers, filters, and combiners—benefit from stable Dk and thermal conductivity to handle high-power signals without overheating.

-High-Power Dividers: Demands precise signal splitting and thermal stability to ensure uniform power distribution across channels.

-Industrial RF Systems: High-power transmitters or receivers (e.g., in telecommunications or radar)