This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.

1. PCB details

2. PCB Stack-up

3. Material Advantages: M6 High Speed Material

The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:

Electrical Performance:

Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).

Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).

Thermal Stability:

High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.

Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.

Mechanical Reliability:

Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).

Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).

Manufacturability & Sustainability:

Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).

Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.

4. Quality & Availability

Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).

Availability: Worldwide (supports global projects for large-scale production).

5. Typical Applications

This PCB is optimized for high-frequency, high-reliability scenarios, including:

5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).

Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).

Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).

Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).