Specifications
Layer count :
2 Layers
Base material :
F4BTMS265
Solder mask :
Black
Copper weight :
1oz (1.4 mils) outer copper layer
Surface finish :
ENIG (Electroless Nickel Immersion Gold)
Brand Name :
Bicheng
Model Number :
BIC-268.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Silkscreen :
White
PCB thickness :
0.85mm
PCB size :
97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm
Description

This 2-layer rigid high-frequency PCB features aerospace-grade F4BTMS265 ceramic-filled dielectric substrate with low electromagnetic loss and minimal anisotropy. It adopts ENIG surface treatment, black top solder mask and white top silkscreen, with a fully mask-free and silkscreen-free bottom side. All units pass 100% electrical testing before delivery, ensuring stable dielectric performance, low signal attenuation and reliable structure for aerospace, military and RF/microwave applications.

PCB Specifications

Parameter Item Specification
Base Material F4BTMS265 upgraded ceramic-filled high-frequency substrate
Layer Configuration 2-layer rigid PCB structure
Board Dimension 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm
Minimum Trace / Space 14 mils / 14 mils
Minimum Mechanical Hole Diameter 0.25mm
Via Type Pure through-hole vias, no blind vias
Finished Board Thickness 0.85mm
Outer Copper Weight 1oz (1.4 mils) outer copper layer
Via Plating Thickness 20μm
Surface Finishing ENIG (Electroless Nickel Immersion Gold)
Top Silkscreen White silkscreen
Bottom Silkscreen Silkscreen-free
Top Solder Mask Black solder mask
Bottom Solder Mask Solder mask-free
Quality Inspection 100% full electrical testing performed prior to delivery

PCB Layer Stack-up Structure

Layer Definition Technical Specification
Top Copper Layer 35μm finished copper thickness
Dielectric Core Substrate F4BTMS265 core, 0.762mm (30mil) thickness
Bottom Copper Layer 35μm finished copper thickness

2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

Artwork & Quality Compliance

Production File Standard: Fabricated based on industry-standard Gerber RS-274-X files, supporting high-precision circuit patterning and full compatibility with mainstream industrial manufacturing processes.

Quality Standard: All fabrication and inspection procedures comply strictly with IPC-Class-2 specifications, ensuring stable electrical performance and long-term structural reliability.

Global Availability: Worldwide supply and logistics services are available to support global aerospace and high-frequency electronic projects.

F4BTMS265 Material Profile

F4BTMS265 is an upgraded high-reliability ceramic-reinforced PTFE dielectric substrate optimized from the standard F4BTM series. Filled with uniformly distributed nano-ceramic particles and ultra-fine glass fiber, it reduces glass fiber-caused electromagnetic interference, dielectric loss and structural anisotropy. Adopting low-roughness RTF copper foil as standard, it delivers low conductor loss and stable peel strength, and supports copper/aluminum base lamination. With excellent dimensional, thermal and dielectric stability, this aerospace-grade material serves as a high-performance substitute for imported high-frequency substrates in military and aerospace applications.

2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

Typical Application Fields

Featuring ultra-low dielectric loss, minimal structural anisotropy, superior thermal stability and aerospace-grade reliability, F4BTMS265-based PCBs are well-suited for deployment in high-precision, phase-sensitive high-frequency electronic systems:

  • Aerospace devices, space equipment and cabin electronic systems
  • High-frequency RF and microwave circuit systems
  • High-precision military radar equipment
  • Antenna feed network components
  • Phase-sensitive antennas and phased array antenna systems
  • Satellite communication systems

2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

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2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

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Layer count :
2 Layers
Base material :
F4BTMS265
Solder mask :
Black
Copper weight :
1oz (1.4 mils) outer copper layer
Surface finish :
ENIG (Electroless Nickel Immersion Gold)
Brand Name :
Bicheng
Contact Supplier
2-layer F4BTMS265 PCB 30mil High-Frequency Substrate
2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

Bicheng Electronics Technology Co., Ltd

Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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