Introducing our newly shipped PCB based on the RF-60A Organic Ceramic Fiberglass Reinforced Laminate. This advanced product boasts a unique composition that offers exceptional electrical properties and low moisture absorption. With its woven fiberglass reinforcement, RF-60A ensures excellent dimensional stability, enhanced flexural strength, and reliable plated-through-hole performance even in extreme thermal environments. This laminate also exhibits remarkable interlaminar bond strength and solder resistance, making it a top choice for various applications.

Taconic, a renowned leader in RF laminates and high-speed digital materials, brings you RF-60A as part of their comprehensive range of high-frequency laminates and prepregs. These cutting-edge materials find application in antennas, multilayer RF and high-speed digital boards, interconnections, and devices, enabling unparalleled performance and connectivity.

Features:
- RF-60A offers a dielectric constant (Dk) of 6.15 at 10GHz, ensuring stable performance across frequencies.
- With a dissipation factor of .0028 at 10GHz, this laminate minimizes signal loss and distortion.
- It exhibits a low coefficient of thermal expansion (CTE), with 9 ppm/°C in the x-axis, 8 ppm/°C in the y-axis, and 69 ppm/°C in the z-axis, allowing reliable performance from -30°C to 125°C.
- RF-60A features high thermal conductivity of 0.54 W/mk, facilitating efficient heat dissipation.
- Its high flexural strength of 18300 psi (MD) and 14600 psi (CD) ensures durability and reliability.
- This laminate has a moisture absorption rate of 0.02%, maintaining its performance even in humid conditions.
- RF-60A is compliant with ROHS and WEEE regulations, meeting environmental standards.

Benefits:
- The stability of the dielectric constant (Dk) across frequencies ensures consistent performance in various applications.
- RF-60A offers excellent dimensional stability, ensuring reliable operation and ease of integration.
- Its exceptional interlaminar bond strength guarantees the integrity and durability of the PCB.
- The low Z-axis expansion of RF-60A allows for reliable plated-through-hole connections, even in extreme thermal environments.

This PCB features a 2-layer rigid construction that ensures optimal performance and durability. The stackup consists of copper layers sandwiching the RF-60A core. The first copper layer has a thickness of 35 μm, followed by the RF-60A core, which measures 0.635 mm (25mil) in thickness. Lastly, the second copper layer, also 35 μm thick, completes the stackup. This construction provides a solid foundation for reliable circuit connections and efficient signal transmission.

PCB Construction Details:
- Board Dimensions: The PCB measures 83mm x 65mm with a tolerance of +/- 0.15mm, providing a compact and precise form factor.
- Minimum Trace/Space: The PCB supports a minimum trace width and spacing of 6/7 mils, allowing for intricate circuit designs.
- Minimum Hole Size: The PCB accommodates a minimum hole size of 0.4mm, enabling the use of various components.
- No Blind Vias: The design does not include blind vias, simplifying the manufacturing process.
- Finished Board Thickness: The finished PCB has a thickness of 0.71mm, providing a compact and lightweight solution.
- Finished Copper Weight: The outer copper layers have a weight of 1oz (1.4 mils), ensuring optimal conductivity.
- Via Plating Thickness: The via plating thickness is 20 μm, guaranteeing reliable electrical connections.
- Surface Finish: The PCB features an immersion tin surface finish, providing a protective and solderable layer.
- Top Silkscreen: No top silkscreen is applied to the PCB.
- Bottom Silkscreen: No bottom silkscreen is applied to the PCB.
- Top Solder Mask: No top solder mask is applied to the PCB.
- Bottom Solder Mask: No bottom solder mask is applied to the PCB.
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test before shipment to ensure functionality and quality.

PCB Statistics:
- Components: This PCB contains a total of 17 components, enabling versatile functionality.
- Total Pads: There are 44 pads on this PCB, facilitating component connections.
- Thru Hole Pads: Out of the total pads, 25 are dedicated to through-hole components.
- Top SMT Pads: The remaining 19 pads are for surface mount technology (SMT) components on the top layer.
- Bottom SMT Pads: There are no SMT pads on the bottom layer.
- Vias:it includes 23 vias for interconnection purposes.
- Nets: it contains 4 nets, representing interconnected paths between components.

Additional Information:
This PCB artwork supplied is in Gerber RS-274-X format, ensuring compatibility and accuracy during production. Our quality standard adheres to IPC-Class-2 specifications, guaranteeing reliable performance and manufacturing excellence. The RF-60A PCB is available worldwide, enabling easy access forcustomers around the globe.

Typical Applications:

The RF-60A PCB finds its application in various areas, including:

- Power Amplifiers: It provides a reliable platform for power amplification circuits, ensuring efficient and stable signal amplification.

- Filters & Couplers: The PCB enables the implementation of filters and couplers, ensuring precise signal manipulation and control.

- Passive Components: It accommodates passive components, such as resistors and capacitors, enabling their integration into the circuitry.

- Antennas: The RF-60A PCB supports the creation of high-performance antennas, facilitating wireless communication and connectivity.

With its exceptional properties and reliable construction, the RF-60A PCB offers a versatile and high-quality solution for a wide range of applications.